Micro USB connector hanxia HX MICRO 180 JB2 designed for performance under wide temperature conditions

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Product Description

Product Overview

This document outlines the specifications for the HX MICRO 180JB2, a Micro USB connector manufactured by Shenzhen Hanxia Electronic Co., Ltd. It details the material composition, mechanical, environmental, and electrical performance standards, along with testing methods and reference standards.

Product Attributes

Brand: HX MICRO
Origin: Shenzhen Hanxia Electronic Co., Ltd
Model: HX MICRO 180JB2
Part Number: 180JB2

Technical Specifications

Item	Specification	Test Method/Reference Standard
1. Material Details
Plastic Part	LCP UL94V-0
Contact Terminal Part	C5191, Nickel base, Gold plated contact area 1
Shell Part	SUS201, Nickel base shell plating 50, Tin plating 80
2. Working Conditions
Working Current	1Ampere
Operating Temperature	-30+80
3. Electrical Performance
Contact Resistance	50m MAX	Low power current test on contact area resistance value (Ref: EIA 364-23A)
Insulation Resistance	100M MIN @ 100V DC	Test plastic impedance between adjacent contact pins (Ref: EIA 364-21A)
Withstand Voltage Test	300V AC 1 minute @ 0.5mA	Test plastic withstand voltage between contact pins for 1 minute (Ref: EIA 364-20A)
4. Mechanical Performance
Insertion Force	3.0kgf MAX	When matching with the cable end, the force when the cable end is inserted at a speed of 25mm/min (Ref: EIA 364-13A)
Extraction Force	0.7kgf MIN	When matching with the cable end, the force when the cable end is extracted at a speed of 25mm/min (Ref: EIA 364-13A)
Terminal Single PIN Retention Force	0.5 kgf MIN	Force for contact pin to withdraw from plastic at a speed of 25mm/min (Ref: EIA 364-13A)
Durability Test	5000 cycles	Uniform insertion and extraction at a speed of 600 times per hour (Ref: EIA 364-09A)
Vibration Test	1.5mm amplitude, 10Hz to 55Hz to 10Hz cycle for 2 hours in X/Y/Z directions	Continuous testing for 2 hours in each of the X/Y/Z directions for each cycle (Ref: EIA 364-28A)
5. Environmental Performance
Tin Adhesion	Tin adhesion area 95%	Product welding area immersed in a 2355 tin bath for 50.5 seconds (Ref: MIL STD-202F)
High Temperature Resistance	Appearance: No obvious damage; Contact Resistance: 100m MAX; Insulation Resistance: 100M MIN	Product placed in an 85 high-temperature oven for 96 hours, then placed at room temperature for 3 hours for observation (Ref: MIL STD-1344A)
Low Temperature Resistance	Appearance: No obvious damage; Contact Resistance: 100m MAX; Insulation Resistance: 100M MIN	Product placed in a -40 low-temperature oven for 96 hours, then placed at room temperature for 3 hours for observation (Ref: MIL STD-1344A)
Humidity Resistance	Appearance: No obvious damage; Contact Resistance: 100m MAX; Insulation Resistance: 100M MIN	Product placed in an environment of 402 and 9095RH for 120 hours, then observed (Ref: EIA 364-31A)
Corrosion Resistance	Appearance: No obvious corrosion; Contact Resistance: 50m MAX	Product placed in a salt spray chamber with a salt water concentration of 5% and a temperature of 352 for continuous spraying for 12 hours, then placed at room temperature for 1 hour for observation (Ref: EIA 364-26A)
Solderability	Appearance: No obvious discoloration or blistering; Solder joints: Smooth solder wetting	Recommended reflow curve: [Data not fully provided in source]