Micro USB connector hanxia HX MICRO 6.4 JBWZ with tin plated shell and gold plated contact terminals

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Product Description

Product Overview

This document outlines the specifications for the HX MICRO 6.4 JBWZ, a Micro USB connector manufactured by Shenzhen Hanxia Electronic Co., Ltd. It details the material composition, mechanical, electrical, and environmental performance requirements for the product.

Product Attributes

Brand: HX MICRO
Origin: Shenzhen Hanxia Electronic Co., Ltd
Model: HX MICRO 6.4 JBWZ
Certifications: UL94V-0 (for LCP plastic)

Technical Specifications

Section	Item	Specification	Test Method/Reference Standard
Material Details	Plastic Part	LCP UL94V-0
	Contact Terminal Part	H65, Nickel base, Gold plated contact area 1
	Shell Part	H65, Nickel base 50, Tin plated 80
Mechanical Performance	Insertion Force	3.0kgf MAX	Reference: EIA 364-13A (Insertion force when mating with cable end at 25mm/min)
	Extraction Force	0.7~1.8 kgf	Reference: EIA 364-13A (Extraction force when mating with cable end at 25mm/min)
	Terminal Single PIN Retention Force	0.5 kgf MIN	Reference: EIA 364-09A (Force to withdraw contact PIN from plastic at 25mm/min)
	Durability Test	3000 cycles	Reference: EIA 364-28A (Uniform insertion/extraction at 600 cycles per hour)
Electrical Performance	Contact Resistance	50m MAX	Reference: EIA 364-23A (Test contact resistance value with low power current)
	Insulation Resistance	100M MIN	100V DC
	Withstanding Voltage Test	300V AC 1 minute 0.5mA	Reference: EIA 364-20A (Test plastic withstand voltage between contact pins for 1 minute with 0.5mA current)
	Plastic Impedance between Adjacent Contact Pins		Reference: EIA 364-21A (Test plastic impedance value between adjacent contact pins)
	Contact Resistance (after environmental tests)	100m MAX
	Insulation Resistance (after environmental tests)	100M MIN
Environmental Performance	Solderability	Tin coverage 95%	Product welding area immersed in 2355 tin bath for 50.5 seconds. Reference: MIL STD-202F
	High Temperature Resistance	Appearance: No obvious damage. Contact Resistance: 100m MAX. Insulation Resistance: 100M MIN.	Place product in 85 high-temperature oven for 96 hours, then place at room temperature for 3 hours for observation. Reference: MIL STD-1344A
	Low Temperature Resistance	Appearance: No obvious damage. Contact Resistance: 100m MAX. Insulation Resistance: 100M MIN.	Place product in -40 low-temperature oven for 96 hours, then place at room temperature for 3 hours for observation. Reference: MIL STD-1344A
	Humidity Resistance	Appearance: No obvious damage. Contact Resistance: 100m MAX. Insulation Resistance: 100M MIN.	Place product in an environment of 402 and 9095%RH for 120 hours, then observe. Reference: EIA 364-31A
	Corrosion Resistance	Appearance: No obvious corrosion. Contact Resistance: 50m MAX.	Place product in a salt spray chamber with 5% salt water concentration at 352 for continuous spray for 12 hours, then place at room temperature for 1 hour for observation. Reference: EIA 364-26A
	Solderability (after environmental tests)	Appearance: No obvious discoloration or blistering; Solder on solder legs is smooth.
Other	Working Current	1 Ampere
	Operating Temperature	-30+80
	Vibration Test	Amplitude 1.5mm, frequency from 10Hz to 55Hz and back to 10Hz per minute, continuous testing for 2 hours in X/Y/Z directions.	Reference: EIA 364-28A