USB AF195 Connector HDGC USB ZD 111DIP Featuring High Temperature Resistant Thermoplastic Material
Price:
Negotiable
MOQ:
Negotiable
Delivery Time:
Negotiable
Product Description
Product Overview
This document details the specifications for the USB-ZD-111DIP USB AF19.5 connector, a high-temperature thermoplastic component with gold-plated contacts in the mating area. It is designed for PCB applications and offers specific electrical and mechanical performance characteristics.
Product Attributes
- Brand: Huade co-create Technology ()
- Origin: Shenzhen, China
- Material (Housing): PBT High Temperature Thermoplastics
- Material (Contact): Copper Alloy C2680
- Material (Shell): Copper Alloy C2680/SPCC Nickel Plating, Tin On Solder Tails
- Color: White (implied by '')
Technical Specifications
| Spec | Parameter | Value | Unit |
| Current Rating | Current Rating | 1.5 | A/contact terminal |
| Voltage Rating | Voltage Rating | 30 | V DC |
| Contact Resistance | Contact Resistance | 30 | milliohms MAX |
| Dielectric Withstanding Voltage | Dielectric Withstanding Voltage | 500 | V AC AT Sea Level |
| Insulation Resistance | Insulation Resistance | 1000 | MEGA ohms MIN |
| Connector Mate and Unmate Force | Mate force | 3.57 | kgf(MAX) |
| Connector Mate and Unmate Force | Unmate force | 1.2 | kgf(MIN) |
| Terminal Retention | Terminal Retenion Unmate force | 1.02 | kgf(MIN) |
| Housing Material | Matorial | PBT Hing Temperature Tnermaplastics | |
| Shell Material | Shell | Copper Alloy C2680/SPCC Nickel Plating | |
| Shell Material | Shell | Tin On Solder Talls | |
| Contact Plating | Piated Gold in Mating Area |
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Hefei Purple Horn E-Commerce Co., Ltd.
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Sellina