Compact low profile 1.0mm pitch connector HRS DF19G 20S 1F 05 for wire to board and FPC applications
DF19 Series Connectors
The DF19 Series offers a 1.0mm pitch, low-profile connector solution for wire-to-board, FPC-to-board, and micro-coaxial cable-to-board applications. It has become the de facto standard for LCD panel connections (12in. or less), recognized for its high performance with LVD high-speed differential signals. The series features a low-profile design with cable micro-coaxial types at 1.5mm thickness (1.6mm Max.) and FPC types at 1.7mm Max. A common header is compatible with discrete wire, FPC, and micro-coaxial socket types, allowing for diverse mating combinations. Uniform external dimensions across socket types ensure versatility. Headers are available in top-board, offset, reverse offset, and vertical mounted styles. The metal shell provides ground connection capabilities, and the series is Glow Wire Compatible (IEC60695-2-11 Standard). Applications include mobile phones, LCD connections, DVC, DSC, PDA, camera modules, notebook PCs, and other small electronic equipment.
Product Attributes
- Brand: HIROSE ELECTRIC CO., LTD.
- Certifications: Glow Wire Compatible (IEC60695-2-11 Standard), RoHS2
Technical Specifications
| Item | Specification/Conditions |
| Rated Current | 28 AWG: 1A/pin, 30 AWG: 0.9A/pin, 32 AWG: 0.8A/pin, 36 AWG: 0.5A/pin, FPC Micro-coaxial Cable 40 AWG: 0.3A/pin |
| Operating Temperature | -35 to +85 (Note 1) |
| Operating Humidity Range | 40 to 80% (Note 2) |
| Rated Voltage | 100V AC/DC |
| Storage Temperature Range | -10 to +60 (Note 3) |
| Storage Humidity Range | 40 to 70% (Note 3) |
| Insulation Resistance | 500M Min. (100V DC) |
| Withstanding Voltage | 300V AC for 1 min. (No flashover or insulation breakdown) |
| Contact Resistance | 30m Max. (50m Max. for FPC) (1mA) |
| Vibration | No electrical discontinuity of 1 s or more (Frequency: 10 to 55 Hz, single amplitude of 0.75mm, in 3 directions for 10 cycles) |
| Humidity (Steady State) | Contact Resistance: 30m Max. (50m Max. for FPC), Insulation Resistance: 500M Min. (96 hours at 40 2 and 90 to 95% humidity) |
| Temperature Cycle | Contact Resistance: 30m Max. (50m Max. for FPC), Insulation Resistance: 500M Min. (Temperature: -55 +5 to +35 +85 +5 to +35 for 5 cycles) |
| Mating Durability | Contact Resistance: 30m Max. (50m Max. for FPC) (30 cycles) |
| Soldering Heat Resistance | No deformation of insulator parts affecting performance (Re-flow soldering: Recommended temperature profile; Manual soldering: 350, 5 seconds) |
Materials / Finish
| Product Component | Material | Finish / Color | Remarks |
| Pin Header Insulator | Polyamide | Black or Beige | UL94V-0 |
| Contacts (Pin Header) | Phosphor Bronze | Partially Gold Plated | - |
| Exterior Shell (Pin Header) | Phosphor Bronze | Partially Tin Plated | - |
| Crimp Case Insulator | Polyamide | Beige | UL94V-0 |
| Exterior Shell (Crimp Case) | Stainless Steel | Tin Plated | - |
| Socket Crimp Contact | Phosphor Bronze | Gold Plated | - |
| FPC Socket Insulator | Polyamide | Beige | UL94V-0 |
| FPC Socket Contact | Phosphor Bronze | Gold Plated | - |
| FPC Grounding Plate | Exterior Shell Stainless Steel | Tin Plated | - |
| Micro-coaxial Socket Insulator | LCP | Beige | UL94V-0 |
| Micro-coaxial Socket Contact | Phosphor Bronze | Partially Gold Plated | - |
| Micro-coaxial Socket Exterior Shell | Phosphor Bronze | Tin Plated | - |
| Grounding Plate for Micro-Coaxial | Exterior Shell Phosphor Bronze | Tin Plated | - |
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