Durable JST PHR-4 connector 2.0mm pitch low profile compact size suitable for high density pcb wiring

Price Negotiable

Price: Negotiable

MOQ: Negotiable

Delivery Time: Negotiable

Product Description

Product Overview

This is a thin, low-profile 2.0mm pitch connector, measuring 8.0mm in height after mounting and 4.5mm in width. It is designed to meet the demand for high-density connection of internal wires to printed circuit boards. It is compact, highly reliable, and low in cost, featuring reliable contact, a fully shrouded header, a printed circuit board retention mechanism, and a surface mount model (SMT) option.

Product Attributes

Brand: JST
Certifications: UL Recognized E60389, Certified LR20812, R75087
RoHS Compliance: Yes

Technical Specifications

Part Type	Model No.	Circuits	Dimensions (mm) A	Dimensions (mm) B	Material / Finish	Q'ty	Applicable Wire (mm)	Applicable Wire (AWG)	Insulation O.D. (mm)	PC Board Thickness (mm)
Contact	SPH-002T-P0.5S	-	-	-	Phosphor bronze, tin-plated (reflow treatment)	8,000 / reel	0.05 0.22	3024	0.91.5	-
Contact	SPH-002T-P0.5L	-	-	-	Phosphor bronze, tin-plated (reflow treatment) (Low insertion force)	10,000 / reel	0.08 0.22	2824	0.81.5	-
Contact	SPH-004T-P0.5S	-	-	-	Phosphor bronze, tin-plated (reflow treatment)	8,000 / reel	0.0320.08	3228	0.50.9	-
Receptacle Housing	PHR-2	2	2.0	5.8	PA 66, UL94V-0, natural (white)	1,000 / box	-	-	-	-
Receptacle Housing	PHR-16	16	30.0	33.8	PA 66, UL94V-0, natural (white)	1,000 / box	-	-	-	-
Header (Through-hole)	PH-K-S (Top entry)	2	2.0	5.9	Post: Brass, copper-undercoated, tin-plated (reflow treatment); Wafer: PA 66, UL94V-0, natural (white)	1,000 / box	-	-	-	0.8 to 1.6
Header (Through-hole)	PH-K-S (Side entry)	2	2.0	5.9	Post: Brass, copper-undercoated, tin-plated (reflow treatment); Wafer: PA 66, UL94V-0, natural (white)	1,000 / box	-	-	-	0.8 to 1.6
Header (Through-hole)	PH-K-S (Top entry)	16	30.0	33.9	Post: Brass, copper-undercoated, tin-plated (reflow treatment); Wafer: PA 66, UL94V-0, natural (white)	250 / box	-	-	-	0.8 to 1.6
Header (Through-hole)	PH-K-S (Side entry)	16	30.0	33.9	Post: Brass, copper-undercoated, tin-plated (reflow treatment); Wafer: PA 66, UL94V-0, natural (white)	250 / box	-	-	-	0.8 to 1.6
Header (Through-hole, Low insertion force)	PH-KL (Top entry)	2	2.0	5.9	Post: Copper alloy, copper-undercoated, tin-plated (reflow treatment); Wafer: PA 66, UL94V-0, gray	1,000 / box	-	-	-	0.8 to 1.6
Header (Through-hole, Low insertion force)	PH-KL (Side entry)	2	2.0	5.9	Post: Copper alloy, copper-undercoated, tin-plated (reflow treatment); Wafer: PA 66, UL94V-0, gray	1,000 / box	-	-	-	0.8 to 1.6
Header (Through-hole, Low insertion force)	PH-KL (Top entry)	16	30.0	33.9	Post: Copper alloy, copper-undercoated, tin-plated (reflow treatment); Wafer: PA 66, UL94V-0, gray	250 / box	-	-	-	0.8 to 1.6
Header (Through-hole, Low insertion force)	PH-KL (Side entry)	16	30.0	33.9	Post: Copper alloy, copper-undercoated, tin-plated (reflow treatment); Wafer: PA 66, UL94V-0, gray	250 / box	-	-	-	0.8 to 1.6
Header (SMT)	PH-SM4-TB (Top entry)	2	2.0	7.9	Post: Copper alloy, copper-undercoated, tin-plated (reflow treatment); Wafer: PA, UL94V-0, natural (ivory); Solder tab: Brass, copper-undercoated, tin-plated (reflow treatment)	1,000 / reel	-	-	-	-
Header (SMT)	PH-SM4-TB (Top entry)	16	30.0	33.9	Post: Copper alloy, copper-undercoated, tin-plated (reflow treatment); Wafer: PA, UL94V-0, natural (ivory); Solder tab: Brass, copper-undercoated, tin-plated (reflow treatment)	1,000 / reel	-	-	-	-
Header (SMT)	PH-SM4-TB (Side entry)	2	2.0	7.95	Post: Copper alloy, copper-undercoated, tin-plated (reflow treatment); Wafer: PA, UL94V-0, natural (ivory); Solder tab: Brass, copper-undercoated, tin-plated (reflow treatment)	1,000 / reel	-	-	-	-
Header (SMT)	PH-SM4-TB (Side entry)	15	28.0	31.95	Post: Copper alloy, copper-undercoated, tin-plated (reflow treatment); Wafer: PA, UL94V-0, natural (ivory); Solder tab: Brass, copper-undercoated, tin-plated (reflow treatment)	1,000 / reel	-	-	-	-