Durable connector for 2.5mm pitch resin coated PC boards JST XAP-03V-1 ensures electrical connections

Price Negotiable
Price: Negotiable
MOQ: Negotiable
Delivery Time: Negotiable
Product Description

Product Overview

The JST XA Connector High Box Type is a disconnectable crimp-style connector designed for 2.5mm pitch applications, specifically for use with resin-coated ("potted") PC boards. It offers high mounting height and thickness, ensuring robust connections.

Product Attributes

  • Brand: JST
  • Material (Header): Glass-filled PA 66, UL94V-0, natural (ivory)
  • Material (Housing): PA 66, UL94V-0, natural (white)
  • Material (Contact): Phosphor bronze, tin-plated (reflow treatment)
  • Material (Post/Wafer): Copper alloy, copper-undercoated, tin-plated (reflow treatment) / Glass-filled PA 66, UL94V-0, natural (ivory)
  • Certifications: UL Recognized E60389, CSA Certified LR20812
  • Compliance: RoHS

Technical Specifications

Product TypeModel No.CircuitsDimensions (mm) ADimensions (mm) BQ'ty / bagQ'ty / reelQ'ty / boxMaterial
Header (High Box Type)XMS-XXV2-152.5 to 35.0-1,000--Glass-filled PA 66, UL94V-0, natural (ivory)
Housing (Standard Type)XAP-XXV-12-152.5 to 35.07.3 to 39.81,000--PA 66, UL94V-0, natural (white)
Housing (Retainer Mountable Type)XARP-XXV2-152.5 to 35.09.8 to 42.31,000 (2-13), 500 (14-15)--PA 66, UL94V-0, natural (white)
ContactSXA-001T-P0.6---8,000--Phosphor bronze, tin-plated (reflow treatment)
Shrouded Header (Without a boss)BHXXB-XASK-BN2-152.5 to 35.07.5 to 40.0--400 (2-3), 300 (4-5), 200 (6-10), 100 (11-15)Post: Copper alloy, tin-plated; Wafer: Glass-filled PA 66, UL94V-0, natural (ivory)
Shrouded Header (With a boss)BHXXB-XASK2-152.5 to 35.010.0 to 42.5--400 (2-3), 300 (4-5), 200 (6-10), 100 (11-15)Post: Copper alloy, tin-plated; Wafer: Glass-filled PA 66, UL94V-0, natural (ivory)
Shrouded Header on Radial Tape (Without a boss)BHXXB-XASS-BN-T2-82.5 to 17.57.5 to 22.5--1,000 (2-3), 500 (4-8)Post: Copper alloy, tin-plated; Wafer: Glass-filled PA 66, UL94V-0, natural (ivory)
Shrouded Header on Radial Tape (With a boss)BHXXB-XASS-T2-82.5 to 17.510.0 to 25.0--1,000 (2-3), 500 (4-8)Post: Copper alloy, tin-plated; Wafer: Glass-filled PA 66, UL94V-0, natural (ivory)

General Specifications

SpecificationValue
Pitch2.5mm
Current Rating3A AC, DC (AWG #22)
Voltage Rating250V AC, DC
Temperature Range-25C to +85C
Contact ResistanceInitial: 10mmax. / After environmental testing: 20mmax.
Insulation Resistance1,000M min.
Withstanding Voltage1,000V AC/minute
Applicable WireAWG #28 to #22
Applicable PC Board Thickness1.6mm

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Hefei Purple Horn E-Commerce Co., Ltd.
Location Room 1306B, Building A, Xindi Center, Qimen Road, Hefei City, Anhui Province
Contact Person Sellina

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