Durable pcb connector JST PHR-2 2 millimeter pitch low profile 8 millimeter height surface mount type

Price Negotiable

Price: Negotiable

MOQ: Negotiable

Delivery Time: Negotiable

Product Description

PH Connector 2.0mm Pitch

This is a thin, low-profile 2.0mm pitch connector, 8.0mm in height after mounting and 4.5mm in width. It is designed to meet the demand for high-density connection of internal wires to printed circuit boards. It is compact, highly reliable, and low in cost, offering reliable contact, a fully shrouded header, and a printed circuit board retention mechanism. Available in Surface Mount Model (SMT).

Product Attributes

Brand: JST
Material (Wafer): PA 66, UL94V-0
Material (Header Post): Brass, copper-undercoated, tin-plated (reflow treatment) or Copper alloy, copper-undercoated, tin-plated (reflow treatment)
Material (Contact): Phosphor bronze, tin-plated (reflow treatment)
Material (Solder tab): Brass, copper-undercoated, tin-plated (reflow treatment)
Color (Wafer): Natural (white), natural (ivory), gray
Certifications: UL Recognized E60389, CSA Certified LR20812, R75087
Compliance: RoHS

Technical Specifications

Model Type	Model No.	Circuits	Dimensions (mm) A	Dimensions (mm) B	Q'ty / box	Material and Finish	Applicable Wire (mm)	Applicable Wire (AWG)	Insulation O.D. (mm)	Q'ty / reel
Contact	SPH-002T-P0.5S	-	-	-	-	Phosphor bronze, tin-plated (reflow treatment)	0.05 0.22	3024	0.91.5	8,000
Contact	SPH-002T-P0.5L	-	-	-	-	Phosphor bronze, tin-plated (reflow treatment) (Low insertion force type)	0.08 0.22	2824	0.81.5	10,000
Contact	SPH-004T-P0.5S	-	-	-	-	Phosphor bronze, tin-plated (reflow treatment)	0.0320.08	3228	0.50.9	-
Receptacle	PHR-2	2	2.0	5.8	1,000	PA 66, UL94V-0, natural (white)	-	-	-	-
Receptacle	PHR-16	16	30.0	33.8	1,000	PA 66, UL94V-0, natural (white)	-	-	-	-
Header (Through-hole)	PH-K-S (Top entry)	2	2.0	5.9	1,000	Post: Brass, copper-undercoated, tin-plated (reflow treatment) Wafer: PA 66, UL94V-0, natural (white)	-	-	-	-
Header (Through-hole)	PH-K-S (Top entry)	16	30.0	33.9	250	Post: Brass, copper-undercoated, tin-plated (reflow treatment) Wafer: PA 66, UL94V-0, natural (white)	-	-	-	-
Header (Through-hole)	PH-K-S (Side entry)	2	2.0	5.9	1,000	Post: Brass, copper-undercoated, tin-plated (reflow treatment) Wafer: PA 66, UL94V-0, natural (white)	-	-	-	-
Header (Through-hole)	PH-K-S (Side entry)	16	30.0	33.9	250	Post: Brass, copper-undercoated, tin-plated (reflow treatment) Wafer: PA 66, UL94V-0, natural (white)	-	-	-	-
Header (Through-hole, Low insertion force type)	PH-KL (Top entry)	2	2.0	5.9	1,000	Post: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: PA 66, UL94V-0, gray	-	-	-	-
Header (Through-hole, Low insertion force type)	PH-KL (Top entry)	16	30.0	33.9	250	Post: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: PA 66, UL94V-0, gray	-	-	-	-
Header (Through-hole, Low insertion force type)	PH-KL (Side entry)	2	2.0	5.9	1,000	Post: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: PA 66, UL94V-0, gray	-	-	-	-
Header (Through-hole, Low insertion force type)	PH-KL (Side entry)	16	30.0	33.9	250	Post: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: PA 66, UL94V-0, gray	-	-	-	-
Header (SMT)	PH-SM4-TB (Top entry)	2	-	7.9	1,000	Post: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: PA, UL94V-0, natural (ivory) Solder tab: Brass, copper-undercoated, tin-plated (reflow treatment)	-	-	-	-
Header (SMT)	PH-SM4-TB (Top entry)	16	-	33.9	1,000	Post: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: PA, UL94V-0, natural (ivory) Solder tab: Brass, copper-undercoated, tin-plated (reflow treatment)	-	-	-	-
Header (SMT)	PH-SM4-TB (Side entry)	2	-	7.9	1,000	Post: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: PA, UL94V-0, natural (ivory) Solder tab: Brass, copper-undercoated, tin-plated (reflow treatment)	-	-	-	-
Header (SMT)	PH-SM4-TB (Side entry)	16	-	33.9	1,000	Post: Copper alloy, copper-undercoated, tin-plated (reflow treatment) Wafer: PA, UL94V-0, natural (ivory) Solder tab: Brass, copper-undercoated, tin-plated (reflow treatment)	-	-	-	-

Specifications

Parameter	Value
Pitch	2.0mm
Current Rating	2A AC, DC (AWG #24)
Voltage Rating	100V AC, DC
Temperature Range	-25C to +85C (including temperature rise in applying electrical current)
Contact Resistance	Initial value/ 10m max. After environmental testing/ 20m max.
Insulation Resistance	1,000M min.
Withstanding Voltage	800V AC/ minute
Applicable wire	AWG #32 to #24
Applicable PC board thickness	0.8 to 1.6mm