Secure locking dual row connector JST PADP-16V-1-S crimp style 2.0mm pitch for electrical connections
Price:
Negotiable
MOQ:
Negotiable
Delivery Time:
Negotiable
Product Description
Product Overview
The PAD CONNECTOR is a disconnectable crimp style connector with a 2.0mm pitch and dual-row construction for high-density mounting. It features a secure locking device, reliable contacts, an insertion guide mechanism, and a polarizing boss.
Product Attributes
- Brand: JST
- Certifications: UL Recognized E60389, 2R50053749
- RoHS Compliance: RoHS2
Technical Specifications
| Component | Model No. | Circuits | Pitch (mm) | Current Rating (A) | Voltage Rating (V) | Wire Gauge (AWG#) | Temperature Range (C) | Contact Resistance (m) | Insulation Resistance (M) | Withstanding Voltage (VAC/min) | PC Board Thickness (mm) | Material | Finish | Insulation O.D. (mm) | Q'ty/ reel | Q'ty/ bag |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Housing | PADP-10V-1-S | 10 | 2.0 | 3 | 250 | #28 to #22 | -25 to +85 | Initial: 10, After Env: 20 | 1,000 | 800 | 1.6 | PA 66 | UL94V-0, natural (white) | 0.130.33 | 1,000 | 10 |
| Housing | PADP-12V-1-S | 12 | 2.0 | 3 | 250 | #28 to #22 | -25 to +85 | Initial: 10, After Env: 20 | 1,000 | 800 | 1.6 | PA 66 | UL94V-0, natural (white) | 0.130.33 | 1,000 | 12 |
| Housing | PADP-14V-1-S | 14 | 2.0 | 3 | 250 | #28 to #22 | -25 to +85 | Initial: 10, After Env: 20 | 1,000 | 800 | 1.6 | PA 66 | UL94V-0, natural (white) | 0.130.33 | 1,000 | 14 |
| Housing | PADP-16V-1-S | 16 | 2.0 | 3 | 250 | #28 to #22 | -25 to +85 | Initial: 10, After Env: 20 | 1,000 | 800 | 1.6 | PA 66 | UL94V-0, natural (white) | 0.130.33 | 1,000 | 16 |
| Housing | PADP-20V-1-S | 20 | 2.0 | 3 | 250 | #28 to #22 | -25 to +85 | Initial: 10, After Env: 20 | 1,000 | 800 | 1.6 | PA 66 | UL94V-0, natural (white) | 0.130.33 | 1,000 | 20 |
| Housing | PADP-22V-1-S | 22 | 2.0 | 3 | 250 | #28 to #22 | -25 to +85 | Initial: 10, After Env: 20 | 1,000 | 800 | 1.6 | PA 66 | UL94V-0, natural (white) | 0.130.33 | 1,000 | 22 |
| Housing | PADP-24V-1-S | 24 | 2.0 | 3 | 250 | #28 to #22 | -25 to +85 | Initial: 10, After Env: 20 | 1,000 | 800 | 1.6 | PA 66 | UL94V-0, natural (white) | 0.130.33 | 1,000 | 24 |
| Housing | PADP-40V-1-S | 40 | 2.0 | 3 | 250 | #28 to #22 | -25 to +85 | Initial: 10, After Env: 20 | 1,000 | 800 | 1.6 | PA 66 | UL94V-0, natural (white) | 0.130.33 | 500 | 40 |
| Contact | SPH-001T-P0.5L | - | - | 3 | 250 | #26 to #22 | -25 to +85 | Initial: 10, After Env: 20 | 1,000 | 800 | - | Phosphor bronze | tin-plated (reflow treatment) | 0.130.33 | 8,000 | - |
| Contact | SPH-002T-P0.5L | - | - | 3 | 250 | #28 to #24 | -25 to +85 | Initial: 10, After Env: 20 | 1,000 | 800 | - | Phosphor bronze | tin-plated (reflow treatment) | 0.080.22 | 8,000 | - |
| Contact | SPND-001T-C0.5 | - | - | 3 | 250 | #26 to #22 | -25 to +85 | Initial: 10, After Env: 20 | 1,000 | 800 | - | Copper alloy | tin-plated (reflow treatment) | 0.130.33 | 8,000 | - |
| Contact | SPND-002T-C0.5 | - | - | 3 | 250 | #28 to #24 | -25 to +85 | Initial: 10, After Env: 20 | 1,000 | 800 | - | Copper alloy | tin-plated (reflow treatment) | 0.080.22 | 8,000 | - |
| Shrouded header | S10B-PADSS-1 | 10 | 2.0 | 3 | 250 | - | -25 to +85 | - | - | - | - | Copper alloy (post), Glass-filled PBT (wafer) | tin-plated (reflow treatment) (post), (natural) (wafer) | - | - | 504 |
| Shrouded header | S12B-PADSS-1 | 12 | 2.0 | 3 | 250 | - | -25 to +85 | - | - | - | - | Copper alloy (post), Glass-filled PBT (wafer) | tin-plated (reflow treatment) (post), (natural) (wafer) | - | - | 420 |
| Shrouded header | S14B-PADSS-1 | 14 | 2.0 | 3 | 250 | - | -25 to +85 | - | - | - | - | Copper alloy (post), Glass-filled PBT (wafer) | tin-plated (reflow treatment) (post), (natural) (wafer) | - | - | 364 |
| Shrouded header | S16B-PADSS-1 | 16 | 2.0 | 3 | 250 | - | -25 to +85 | - | - | - | - | Copper alloy (post), Glass-filled PBT (wafer) | tin-plated (reflow treatment) (post), (natural) (wafer) | - | - | 336 |
| Shrouded header | S20B-PADSS-1 | 20 | 2.0 | 3 | 250 | - | -25 to +85 | - | - | - | - | Copper alloy (post), Glass-filled PBT (wafer) | tin-plated (reflow treatment) (post), (natural) (wafer) | - | - | 280 |
| Shrouded header | S24B-PADSS-1 | 24 | 2.0 | 3 | 250 | - | -25 to +85 | - | - | - | - | Copper alloy (post), Glass-filled PBT (wafer) | tin-plated (reflow treatment) (post), (natural) (wafer) | - | - | 224 |
| Shrouded header | B10B-PADSS-F | 10 | 2.0 | 3 | 250 | - | -25 to +85 | - | - | - | - | Copper alloy (post), Glass-filled PA 66 (wafer) | tin-plated (reflow treatment) (post), (natural) (wafer) | - | - | 400 |
| Shrouded header | B12B-PADSS-F | 12 | 2.0 | 3 | 250 | - | -25 to +85 | - | - | - | - | Copper alloy (post), Glass-filled PA 66 (wafer) | tin-plated (reflow treatment) (post), (natural) (wafer) | - | - | 300 |
| Shrouded header | B14B-PADSS-F | 14 | 2.0 | 3 | 250 | - | -25 to +85 | - | - | - | - | Copper alloy (post), Glass-filled PA 66 (wafer) | tin-plated (reflow treatment) (post), (natural) (wafer) | - | - | 300 |
| Shrouded header | B16B-PADSS-F | 16 | 2.0 | 3 | 250 | - | -25 to +85 | - | - | - | - | Copper alloy (post), Glass-filled PA 66 (wafer) | tin-plated (reflow treatment) (post), (natural) (wafer) | - | - | 200 |
| Shrouded header | B20B-PADSS-F | 20 | 2.0 | 3 | 250 | - | -25 to +85 | - | - | - | - | Copper alloy (post), Glass-filled PA 66 (wafer) | tin-plated (reflow treatment) (post), (natural) (wafer) | - | - | 150 |
| Shrouded header | B22B-PADSS-F | 22 | 2.0 | 3 | 250 | - | -25 to +85 | - | - | - | - | Copper alloy (post), Glass-filled PA 66 (wafer) | tin-plated (reflow treatment) (post), (natural) (wafer) | - | - | 150 |
| Shrouded header | B24B-PADSS-F | 24 | 2.0 | 3 | 250 | - | -25 to +85 | - | - | - | - | Copper alloy (post), Glass-filled PA 66 (wafer) | tin-plated (reflow treatment) (post), (natural) (wafer) | - | - | 150 |
| Shrouded header | B10B-PADSS-1F | 10 | 2.0 | 3 | 250 | - | -25 to +85 | - | - | - | - | Copper alloy (post), Glass-filled PA 66 (wafer) | tin-plated (reflow treatment) (post), (natural) (wafer) | - | - | 400 |
| Shrouded header | B12B-PADSS-1F | 12 | 2.0 | 3 | 250 | - | -25 to +85 | - | - | - | - | Copper alloy (post), Glass-filled PA 66 (wafer) | tin-plated (reflow treatment) (post), (natural) (wafer) | - | - | 300 |
| Shrouded header | B14B-PADSS-1F | 14 | 2.0 | 3 | 250 | - | -25 to +85 | - | - | - | - | Copper alloy (post), Glass-filled PA 66 (wafer) | tin-plated (reflow treatment) (post), (natural) (wafer) | - | - | 300 |
| Shrouded header | B16B-PADSS-1F | 16 | 2.0 | 3 | 250 | - | -25 to +85 | - | - | - | - | Copper alloy (post), Glass-filled PA 66 (wafer) | tin-plated (reflow treatment) (post), (natural) (wafer) | - | - | 200 |
| Shrouded header | B20B-PADSS-1F | 20 | 2.0 | 3 | 250 | - | -25 to +85 | - | - | - | - | Copper alloy (post), Glass-filled PA 66 (wafer) | tin-plated (reflow treatment) (post), (natural) (wafer) | - | - | 150 |
| Shrouded header | B22B-PADSS-1F | 22 | 2.0 | 3 | 250 | - | -25 to +85 | - | - | - | - | Copper alloy (post), Glass-filled PA 66 (wafer) | tin-plated (reflow treatment) (post), (natural) (wafer) | - | - | 150 |
| Shrouded header | B24B-PADSS-1F | 24 | 2.0 | 3 | 250 | - | -25 to +85 | - | - | - | - | Copper alloy (post), Glass-filled PA 66 (wafer) | tin-plated (reflow treatment) (post), (natural) (wafer) | - | - | 150 |
| Shrouded header | B40B-PADSS-1F | 40 | 2.0 | 3 | 250 | - | -25 to +85 | - | - | - | - | Copper alloy (post), Glass-filled PA 66 (wafer) | tin-plated (reflow treatment) (post), (natural) (wafer) | - | - | 100 |
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Company
Hefei Purple Horn E-Commerce Co., Ltd.
Location
Room 1306B, Building A, Xindi Center, Qimen Road, Hefei City, Anhui Province
Contact Person
Sellina