electronic flip top housing component Megastar ZX-1.0FPC-2H-QFX20P with LCP UL94V-0 material and copper alloy tin plating

Price Negotiable
Price: Negotiable
MOQ: Negotiable
Delivery Time: Negotiable
Product Description

Product Overview

This product is a component designed for electronic applications, featuring a flip-top housing style. It is compatible with 0.5mm pitch FPC (Flexible Printed Circuit) connectors and supports both PCB layout and flat cable connections. The component is constructed from LCP material and copper alloy with tin plating, ensuring reliable electrical performance and durability within a specified temperature range.

Product Attributes

  • Material: LCP, Copper Alloy/Surface Tin Plated
  • Housing Style: Front Flip-Top
  • Color: Natural (for LCP), Black (for LCP)
  • Certifications: UL94V-0

Technical Specifications

Item Description Pitch Height Part Number
Housing (H2.0) 0.5mm Flip-Top Housing (LCP UL94V-0, Natural) 0.5 mm 2.0 mm ZX-1.0FPC-2H-QFX20P
Back Cover (H2.0) 0.5mm Flip-Top Back Cover (LCP UL94V-0, Black) 0.5 mm 2.0 mm ZX-1.0FPC-2H-QFX20P
Solder Tab (H2.0) 0.5mm Flip-Top Solder Tab (Copper Alloy/Surface Tin Plated) 0.5 mm 2.0 mm ZX-1.0FPC-2H-QFX20P
Terminal (H2.0) 0.5mm Flip-Top Terminal (Copper Alloy/Surface Tin Plated) 0.5 mm 2.0 mm ZX-1.0FPC-2H-QFX20P
General Technical Indicators:
Surface Finish of Plastic Parts Should be smooth, free of burrs, obvious shrinkage, defects, cracks, etc.
Temperature Range -25C ~ 85C
Rated Voltage 50V, AC/DC (equivalent)
Contact Resistance 0.03
Insulation Resistance 500M

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Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Hefei Purple Horn E-Commerce Co., Ltd.
Location Room 1306B, Building A, Xindi Center, Qimen Road, Hefei City, Anhui Province
Contact Person Sellina

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