electronic component Megastar ZX-1.0FPC-2H-QFX6P featuring 0.5mm pitch and 2.0mm height front flip cover design
Price:
Negotiable
MOQ:
Negotiable
Delivery Time:
Negotiable
Product Description
Product Overview
This product is a series of components designed for electronic applications, featuring a front flip-cover style. It is compatible with specific PCB layouts and flat cables, offering a compact design with a 0.5mm pitch and 2.0mm height. The components are constructed from durable materials like LCP and copper alloy, with tin plating for conductivity and reliability, suitable for operation within a temperature range of -25C to 85C.
Product Attributes
- Style: Front Flip-cover
- Material: LCP, Copper Alloy
- Plating: Tin-plated
- Certifications: UL94V-0
- Color: Natural (LCP), Black (LCP)
Technical Specifications
| Item | Description | Material | Pitch | Height | Model Number |
|---|---|---|---|---|---|
| 1 | 0.5mm Flip Cover Housing (H2.0) | LCP UL94V-0 (Natural) | 0.5mm | 2.0mm | ZX-1.0FPC-2H-QFX6P |
| 2 | 0.5mm Flip Cover Back Cover (H2.0) | LCP UL94V-0 (Black) | 0.5mm | 2.0mm | |
| 3 | 0.5mm Flip Cover Solder Tab (H2.0) | Copper Alloy/Surface Plating Tin | 0.5mm | 2.0mm | |
| 4 | 0.5mm Flip Cover Terminal (H2.0) | Copper Alloy/Surface Plating Tin | 0.5mm | 2.0mm | |
| General Technical Specifications: | |||||
| Plastic Surface Quality | Smooth, no burrs, no obvious shrinkage, defects, or cracks. | ||||
| Temperature Range | -25C to 85C | ||||
| Rated Voltage | 50V AC/DC (Equivalent) | ||||
| Contact Resistance | 0.03 | ||||
| Insulation Resistance | 500M | ||||
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Company
Hefei Purple Horn E-Commerce Co., Ltd.
Location
Room 1306B, Building A, Xindi Center, Qimen Road, Hefei City, Anhui Province
Contact Person
Sellina