TF card external welding connector SHETIME TFW11-S1F1-2000-A with SUS201 shell and UL498 certification

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Product Description

Product Overview

This product specification defines the product performance and test methods for the T-FLASH connector, designed and manufactured by the company. It is a TF card external welding connector.

Product Attributes

Brand: SHELL CD PAD
Origin: Taiwan Factory: , China Factory:
Material: HOUSING: LCP UL94-V0, CONTACT: COPPER ALLOY, SHELL: SUS201
Certifications: UL498

Technical Specifications

Item	Requirements	Test Methods
Product Confirmation	Product shall be conforming to the requirements of applicable product drawing.	Visually, dimensions and functionally inspected per applicable product drawing.
Contact resistance (Low Level)	80 m Max. initial	Subject mated contacts assembled in housing to closed circuit of 10 mA max. at open circuit voltage of 20 mV max.
Insulation resistance	1000 M Min.	Measure by applying test potential between the adjacent contacts, and between the contacts and ground in the mated connector. MIL-STD-202, Method 302, Condition B (500 V DC10%).
Dielectric Strength	Connector must withstand test potential of 500 V AC for 1 minute. Current l
Mechanical & Electrical Characteristic	As described in Table I
Material	Harmful material can follow the requirement of RoHS.
Electroplating Specifications	NICKEL UNDERLAYER 40U" MIN, CONTACT AREA GOLD 0.5U"MIN, SOLDER LEG AREA MATTE TIN 80U"MIN.
Plating	CONTACT: GOLD FLASH PLATED. SHELL: NICKEL PLATED.
Electrical Characteristics	CONTACT CURRENT RATING :O.5A MAX, CONTACT RESISTANCE 100 m MAX, INSULATION RESISTANCE 5OO M MIN
Solderability	Connectors solderability can meet MIL-STD-202F standard. Finish shall be free of contaminants.
Resistance to Solder Heat (SMT)	Preheat: Increase in temperature not to exceed 4 per second. Final preheat temperature will be within 125 of solder temperature. Soldering: Device leads will be exposed to solder wave at 250 for a maximum of 5 seconds. Cool Down: Cool down in ambient air at approximately 20 to 25.
Resistance to Solder Heat (Infrared Reflow)	Preheat: Increase in temperature not to exceed 4 per second. Soldering: Maximum allowable time above reflow temperature of 183 is 90 seconds. Maximum temperature in this interval is 260, not to exceed 10 seconds. Cool Down: Cool down shall not exceed 6 per second.	Device temperature measurements are referenced from the top-center of the package outer surface.
Cleaning	Aqueous Cleaning: Three cycles; each cycle consisting of a maximum of one minute exposure to 54 to 66 demineralized tap water at a maximum pressure of 30 psi; followed by air drying for 60 to 90 seconds at 93 to 121.
Storage	Temperature: -25~+85, Relative humidity: 80%, Not to storage in corrosive environments. A re-qualification test shall be conducted immediately while the storage duration exceed 6 months.
Transportation	Any vehicle can be adopted for the transportation, but moisture-proof and no mechanical damage.