Nano sim card socket connector SHETIME NOS11-S1F1-2000-A featuring lcp housing and gold flash plating for performance

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Delivery Time: Negotiable

Product Description

Product Overview

This specification covers the NANO SIM card socket connector, designed for reliable connectivity in various applications. It offers both with and without SIM card detection features, ensuring flexibility in design. The connector is built with high-quality materials and undergoes rigorous testing to meet electrical, mechanical, and environmental performance requirements.

Product Attributes

Brand: GAOYUEDA ELECTRONICS CO.,LTD
Origin: Dongguan, China & Taiwan
Material: Housing: LCP S475 UL 94V-0, Contact: C5191, Shell: SUS304-H
Color: Black (Housing)
Certifications: RoHS

Technical Specifications

Part Number	Description	Material (Housing/Contact/Shell)	Finish (Contact)	Electrical Characteristics (Rating Current/Contact Resistance/Dielectric Withstanding/Insulation Resistance)	Mechanical Characteristics (Mating Cycles)	Operating Temperature	Storage Temperature
NOS11-S1F1-2000-A / NOS21-S1F1-2000-A	NANO SIM Card Socket (with/without pillar)	LCP S475 UL 94V-0 / C5191 / SUS304-H	Gold Flash Plated on Contact Area; Gold Flash Plated on Solder Tails	0.5A MAX / 50 m MAX / 500V AC MIN / 1000 M MIN	3000 CYCLES	-20 C to +65C	-10 ~ +40

Test Requirements Summary

Test Item	Requirement	Procedure
Contact Resistance	50 m Ohm Max (Initial), 100 m Ohm Max (Final)	EIA-364-23A
Dielectric Withstanding Voltage	500 VAC for 1 minute (No creeping discharge or flashover)	EIA-364-20A
Insulation Resistance	100 M Ohm Min. (at 250 VDC)	EIA-364-21A
Vibration	No physical damage, Current discontinuity 10 s, Contact Resistance 100m	EIA-364-28A
Mechanical Shock	No damage, loose part nor crack, Discontinuity: 10s MAX, Contact Resistance100m	MIL-STD-202
Durability	No physical damage, Contact Resistance 100m	EIA-RS-364-09A (3000 cycles)
Contact Normal Force	40gf /pin Min. (Initial), 25~35gf /pin Min. (After durability)	Tensile force test equipment
Contact Retention Force	50gf /pin Min.	Tensile strength tester
Humidity Test (Steady state)	No physical damage, Contact resistance 100 m, Insulation Resistance 1000 M	EIA-RS-364-31A (402, 90~95% RH for 96 hours)
Thermal Shock	No physical damage, Contact resistance 100 m, Insulation Resistance 1000 M	EIA-364-32C (5 cycles of -55 to +85)
Temperature Life	No physical damage, Contact resistance 100 m, Insulation Resistance 1000 M	85+2 for 96 hours
Solderability	No physical damage, Coverage 95% Min.	EIA-RS-364-52 (Sn63 at 245 5 for 10 0.5 seconds)
Salt Spray	No detrimental corrosion allowed in contact area, Contact resistance 100 m	EIA-RS-364-26A (5% salt water, 352 for 16 hours)
Resistance to soldering heat	No evidence of physical damage	Reflow soldering test condition (Fig 1)