High reliability SHOU HAN MICRO XNJ JB2 connector designed for harsh environments and stable performance

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Product Description

Product Overview

This document specifies the requirements for the MICRO XNJ JB2 product from Shenzhen Shouhan Technology Co., Ltd. It details material composition, mechanical, electrical, and environmental performance specifications, along with testing methods and reference standards. This product is designed for applications requiring reliable connectivity under various operating conditions.

Product Attributes

Brand: MICRO XNJ
Model: JB2
Manufacturer: (SHENZHEN SHOUHAN TECHNOLOGY CO.,LTD)
Origin: Shenzhen, China
Certifications: UL94V-0 (for LCP material)

Technical Specifications

Specification	Details	Reference Standard
Material Details
1.1 Plastic Part	LCP UL94V-0
1.2 Contact Terminal Part	C5191-EH, Nickel plated, Gold plated contact area 1
1.3 Housing Part	H65, Nickel plated base 50, Tin plated 80
Working Conditions
2.1 Working Current	1.0 Ampere
2.2 Operating Temperature	-30+80
Electrical Performance
3.1 Contact Resistance	50m MAX (Low power current test)	EIA 364-23A
3.2 Insulation Resistance	100M MIN (100V DC)
3.3 Withstand Voltage Test	300V AC 1 minute 0.5mA	EIA 364-20A
Mechanical Performance
4.1 Insertion Force	3.0kgf MAX	EIA 364-13A
4.2 Withdrawal Force	0.7kgf MIN	EIA 364-13A
4.3 Terminal Single PIN Retention Force	0.5 kgf MIN (Force to withdraw contact PIN from plastic at 25mm/min)	EIA 364-13A
4.4 Durability Test	3000 cycles (Uniform insertion/extraction at 600 cycles/hour)	EIA 364-09A
4.5 Vibration Test	Amplitude 1.5mm, Frequency 10Hz-55Hz-10Hz cycle, 2 hours each in X/Y/Z directions	EIA 364-28A
Environmental Performance
5.1 Solderability	Tin dipping area 95%	MIL STD-202F (Product welding area immersed in 2355 tin bath for 50.5 seconds)
5.2 High Temperature Resistance	Appearance: No obvious damage. Contact Resistance: 100m MAX. Insulation Resistance: 100M MIN.	MIL STD-1344A (Product placed in 85 oven for 96 hours, then at room temperature for 3 hours)
5.3 Low Temperature Resistance	Appearance: No obvious damage. Contact Resistance: 100m MAX. Insulation Resistance: 100M MIN.	MIL STD-1344A (Product placed in -40 oven for 96 hours, then at room temperature for 3 hours)
5.4 Humidity Resistance	Appearance: No obvious damage. Contact Resistance: 100m MAX. Insulation Resistance: 100M MIN.	EIA 364-31A (Product placed in 402, 9095RH environment for 120 hours)
5.5 Corrosion Resistance	Appearance: No obvious corrosion. Contact Resistance: 50m MAX.	EIA 364-26A (Product placed in 5% salt solution at 352 for 12 hours continuous spray, then at room temperature for 1 hour)
5.6 Solder Heat Resistance	Appearance: No obvious discoloration or blistering. Solder joints: Smooth tin dipping.	(Recommended Reflow Curve: Not fully specified in source)