MICRO USB connector SHOU HAN MICRO DNJ ZB designed to operate under wide temperature range and current

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Product Description

Product Overview

This specification document outlines the details for the MICRO DNJ ZB product, a Micro USB connector manufactured by SHENZHEN SHOUHAN TECHNOLOGY CO.,LTD. It details material specifications, mechanical, electrical, and environmental performance criteria.

Product Attributes

Brand: MMICRO
Origin: Shenzhen, China
Manufacturer: (SHENZHEN SHOUHAN TECHNOLOGY CO.,LTD)
Model: MICRO DNJ ZB

Technical Specifications

Test Item	Specification and Standard	Test Method and Reference Standard
Material Details
Plastic Part	LCP UL94V-0
Contact Terminal Part	C5191-EH, Nickel base, Contact area Gold plated 1
Housing Part	H65, Housing Nickel base 50, Tin plated 80
Working Conditions
Working Current	1.0 Ampere
Operating Temperature	-30+80
Mechanical Performance
Insertion Force	3.0kgf MAX	Reference: EIA 364-13A (Insertion speed: 25mm/min)
Withdrawal Force	0.7~1.8 kgf	Reference: EIA 364-13A (Withdrawal speed: 25mm/min)
Single PIN Retention Force	0.5 kgf MIN	Reference: EIA 364-23A (Force to withdraw contact pin from plastic at 25mm/min)
Durability Test	3000 cycles	Uniform insertion/withdrawal at 600 cycles/hour. Reference: EIA 364-09A
Vibration Test	Amplitude 1.5mm, Frequency 10Hz-55Hz-10Hz cycle for 2 hours in X/Y/Z directions.	Reference: EIA 364-28A
Electrical Performance
Contact Resistance	50m MAX	Tested with low power current. Reference: EIA 364-23A
Insulation Resistance	100M MIN	Tested with low voltage current. Reference: EIA 364-23A
Withstanding Voltage	300V AC 1 minute 0.5mA	Test impedance between adjacent contact pins. Reference: EIA 364-20A
Environmental Performance
Solderability	Tin dipping area 95%	Product welding area immersed in 2355 tin bath for 50.5 seconds. Reference: MIL STD-202F
High Temperature Resistance	Appearance: No obvious damage. Contact Resistance: 100m MAX. Insulation Resistance: 100M MIN.	Product placed in 85 oven for 96 hours, then at room temperature for 3 hours. Reference: MIL STD-1344A
Low Temperature Resistance	Appearance: No obvious damage. Contact Resistance: 100m MAX. Insulation Resistance: 100M MIN.	Product placed in -40 oven for 96 hours, then at room temperature for 3 hours. Reference: MIL STD-1344A
Humidity Resistance	Appearance: No obvious damage. Contact Resistance: 100m MAX. Insulation Resistance: 100M MIN.	Product placed in 402, 9095RH environment for 120 hours. Reference: EIA 364-31A
Corrosion Resistance	Appearance: No obvious corrosion. Contact Resistance: 50m MAX.	Product placed in salt spray chamber with 5% salt water concentration at 352 for 12 hours continuous spray, then at room temperature for 1 hour. Reference: EIA 364-26A
Solderability (Reflow)	Appearance: No obvious discoloration or blistering; Solder joints smooth.	Recommended reflow curve: [Data not fully specified in input]