Micro USB Connector SHOU HAN MICRO 5.9ZB5.0 WZ with Gold Plated Contact Area and Mechanical Strength
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Product Description
Product Overview
This document outlines the specifications for the MICRO 5.9ZB5.0 WZ, a Micro USB connector manufactured by SHENZHEN SHOUHAN TECHNOLOGY CO.,LTD. It details material composition, mechanical, electrical, and environmental performance standards.
Product Attributes
- Brand: MICRO
- Model: 5.9ZB5.0 WZ
- Origin: Shenzhen, China
- Manufacturer: SHENZHEN SHOUHAN TECHNOLOGY CO.,LTD
- Certifications: UL94V-0 (for LCP plastic)
Technical Specifications
| Category | Item | Specification | Test Method/Reference |
|---|---|---|---|
| Material Details | Plastic Part | LCP UL94V-0 | |
| Contact Terminal Part | C5191R-H, Nickel base, Gold plated contact area 1 | ||
| Shell Part | C2680, Nickel base 50, Tin plated 80 | ||
| Mechanical Performance | Insertion Force | 3.0kgf MAX | EIA 364-13A (Insertion speed: 25mm/min) |
| Extraction Force | 0.7~1.8 kgf | EIA 364-13A (Extraction speed: 25mm/min) | |
| Single PIN Retention Force | 0.5 kgf MIN | EIA 364-09A (Retraction force of contact pin from plastic at 25mm/min) | |
| Durability | 3000 cycles | EIA 364-28A (Plug/unplug speed: 600 cycles/hour) | |
| Vibration Test | 1.5mm Amplitude, 10Hz-55Hz-10Hz cycle, 2 hours each in X/Y/Z directions | ||
| Electrical Performance | Contact Resistance | 50m MAX | EIA 364-23A (Tested with low power current) |
| Insulation Resistance | 100M MIN (at 100V DC) | ||
| Withstanding Voltage Test | 300V AC 1 minute, 0.5mA | EIA 364-20A (High voltage resistance between adjacent contact pins) | |
| Plastic Impedance Between Adjacent Contact Pins | 100m MAX (at 0.5mA) | EIA 364-21A | |
| Working Current | 1.0 Ampere | ||
| Operating Temperature | -30+80 | ||
| Solderability | Tin dipping area 95% | Immersion in 2355 tin bath for 50.5 seconds (MIL STD-202F) | |
| Environmental Performance | High Temperature Resistance | Appearance: No obvious damage. Contact Resistance: 100m MAX. Insulation Resistance: 100M MIN. | 96 hours in 85 oven, then 3 hours at room temp. (MIL STD-1344A) |
| Low Temperature Resistance | Appearance: No obvious damage. Contact Resistance: 100m MAX. Insulation Resistance: 100M MIN. | 96 hours in -40 oven, then 3 hours at room temp. (MIL STD-1344A) | |
| Humidity Resistance | Appearance: No obvious damage. Contact Resistance: 100m MAX. Insulation Resistance: 100M MIN. | 120 hours in 402, 9095RH environment. (EIA 364-31A) | |
| Corrosion Resistance | Appearance: No obvious corrosion. Contact Resistance: 50m MAX. | 12 hours continuous spray in salt fog box (5% salt water concentration, 352), then 1 hour at room temp. (EIA 364-26A) | |
| Solder Heat Resistance | Appearance: No obvious discoloration or blistering. Solderable pins: Smooth tin dipping. | Reflow curve recommended (details not provided in source) | |
| Tin Adhesion | Tin dipping area 95% | Product welding area immersed in 2355 tin bath for 50.5 seconds (MIL STD-202F) |
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