Durable MICRO USB Connector SHOU HAN MICRO CBJB1.17-4P with Gold Plated Contacts and Nickel Base Shell

Price Negotiable

Price: Negotiable

MOQ: Negotiable

Delivery Time: Negotiable

Product Description

Product Overview

This document specifies the MICRO USB connector, model CBJB1.17-4P, manufactured by Shenzhen Shouhan Technology Co., Ltd. It details the material composition, operating conditions, electrical, mechanical, and environmental performance specifications, along with testing methods and standards.

Product Attributes

Brand: MICRO ( MICRO)
Origin: Shenzhen, China ()
Material - Plastic: LCP UL94V-0
Material - Contact Terminal: C5191R-H, Nickel base, Gold plated contact area (1")
Material - Shell: C2680R-H, Nickel base shell (50"), Nickel plating (80)
Certifications: Not explicitly stated but testing references MIL STD and EIA standards.

Technical Specifications

Test Item	Specification and Standard	Test Method and Reference Standard
Contact Resistance	50m MAX	Test contact impedance at low power current. Reference: EIA 364-23A
Insulation Resistance	100M MIN	Test plastic impedance between adjacent contact pins. Reference: EIA 364-21A
Withstand Voltage Test	100V DC / 300V AC for 1 minute, 0.5mA	Test plastic withstand voltage between contact pins. Reference: EIA 364-20A
Insertion Force	3.57kgf MIN (with cable end)	Force when cable end is inserted at 25mm/min speed. Reference: EIA 364-13A
Extraction Force	1.00kgf MIN (with cable end)	Force when cable end is extracted at 25mm/min speed. Reference: EIA 364-13A
Contact Pin Retention Force	0.3 kgf MIN	Force for contact pin to retract from plastic at 25mm/min speed.
Durability Test	3000 cycles	Insert and extract product at a uniform speed of 600 times per hour. Reference: EIA 364-09A
Vibration Test	Amplitude 1.5mm, 10Hz to 55Hz (X/Y/Z directions, 2 hours each)	Frequency cycle: 10Hz to 55Hz back to 10Hz. Reference: EIA 364-28A
Solderability	Tin coverage 95%	Product welding area immersed in a 2355 tin bath for 50.5 seconds. Reference: MIL STD-202F
High Temperature Resistance	Appearance: No obvious damage; Contact Resistance: 100m MAX; Insulation Resistance: 100M MIN	Product placed in an 85 oven for 96 hours, then at room temperature for 3 hours. Reference: MIL STD-1344A
Low Temperature Resistance	Appearance: No obvious damage; Contact Resistance: 100m MAX; Insulation Resistance: 100M MIN	Product placed in a -40 oven for 96 hours, then at room temperature for 3 hours. Reference: MIL STD-1344A
Humidity Resistance	Appearance: No obvious damage; Contact Resistance: 100m MAX; Insulation Resistance: 100M MIN	Product placed in an environment of 402 and 90~95% RH for 120 hours. Reference: EIA 364-31A
Corrosion Resistance	Appearance: No obvious corrosion; Contact Resistance: 50m MAX	Product placed in a 5% salt water fog chamber at 352 for 12 hours continuous spray, then at room temperature for 1 hour. Reference: EIA 364-26A
Solder Heat Resistance	Appearance: No obvious discoloration or blistering; Solderable pins: Smooth tinning	Recommended reflow curve: (Temperature graph omitted as it's visual)