Micro USB connector SHOU HAN MICRO 2PCB1.0 ZB designed for data and power transmission applications

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Product Description

Product Overview

This document specifies the MICRO 2PCB1.0 ZB, a Micro USB connector from SHENZHEN SHOUHAN TECHNOLOGY CO.,LTD. It is designed for various applications requiring reliable data and power transmission.

Product Attributes

Brand: SHOUHAN
Origin: Shenzhen, China
Material (Plastic): LCP UL94V-0
Material (Contact Terminal): C5191R-H, Nickel base, Gold plated contact area (1")
Material (Shell): H65, Nickel plated base (50"), Tin plated (80")
Model: MICRO 2PCB1.0 ZB
Date: 2020.8.17

Technical Specifications

Section	Specification	Test Method/Reference Standard
Material Details	1.1 Plastic: LCP UL94V-0 1.2 Contact Terminal: C5191R-H, Nickel base, contact area Gold plated 1 1.3 Shell: H65, Shell Nickel plated base 50, Tin plated 80
Electrical Performance	3.1 Contact Resistance: 50m MAX 3.2 Insulation Resistance: 100M MIN (at 100V DC) 3.3 Withstand Voltage: 300V AC 1 minute, 0.5mA	Ref: EIA 364-23A (Contact Resistance) Ref: EIA 364-20A (High Voltage between contacts)
Mechanical Performance	4.1 Insertion Force: 3.0kgf MAX 4.2 Withdrawal Force: 0.7~1.8 kgf 4.3 Terminal Single PIN Retention Force: 0.5 kgf MIN 4.4 Durability: 3000 cycles (uniform plugging/unplugging at 600 cycles/hour) 4.5 Vibration Test: 1.5mm amplitude, 10Hz-55Hz-10Hz cycle, 2 hours per X/Y/Z direction	Ref: EIA 364-13A (Insertion/Withdrawal Force) Ref: EIA 364-09A (Durability) Ref: EIA 364-28A (Vibration)
Environmental Performance	5.1 Tin Solderability: 95% or more tin coverage area 5.2 High Temperature Resistance: No obvious damage after 96 hours at 85, then 3 hours at room temp. 5.3 Low Temperature Resistance: No obvious damage after 96 hours at -40, then 3 hours at room temp. 5.4 Humidity Resistance: Observe after 120 hours at 402, 9095%RH. 5.5 Corrosion Resistance: No obvious corrosion after 12 hours continuous spray in 5% salt solution at 352, then 1 hour at room temp. 5.6 Solderability: No obvious discoloration/bubbling; smooth solder wetting on solder pins. Immersion in 2355 solder bath for 50.5 seconds.	Ref: MIL STD-202F (Solderability) Ref: MIL STD-1344A (High/Low Temp) Ref: EIA 364-31A (Humidity) Ref: EIA 364-26A (Corrosion)
Working Conditions	2.1 Working Current: 1.0 Ampere 2.2 Operating Temperature: -30+80