NANO SIM Card Socket with Push Lever and Surface Mounting Featuring Thimble Structure SOFNG SNO 019KT
Product Overview
This NANO-SIM card socket features a thimble structure with lateral insertion and a push lever for reliable operation. Designed for surface mounting (SMT), it offers a stable and precise connection for NANO-SIM cards. It is suitable for environmental compliance with RoHS standards.
Product Attributes
- Operation: Thimble Structure
- Insertion Type: Lateral Insertion
- Mounting Type: Surface Mount (SMT)
- Environmental Compliance: RoHS
- Housing Color: Black
Technical Specifications
| Specification | Model A [better product] | Model B [average product] | Model C [low product] |
|---|---|---|---|
| Model No. | SNO-019 | SNO-019 | SNO-019 |
| Contact Resistance (Initial) | 30m max. | 30m max. | no data! |
| Contact Resistance | 100M min. (100V DC) | Skey/PD: 50M min. (100V DC) | no data! |
| Withstand Voltage | 300V AC for 1min | 250 V AC for 1min | no data! |
| Durable Performance (No Load) | 8,000 Cycles | 7,000 Cycles | no data! |
| Durable Performance (Rated Load) | 6,500 Cycles | 5,000 Cycles | no data! |
| Insertion Force | 4.0Kgf MAX | 30m max. | no data! |
| Material - Contact | COPPER ALLOYG/F 0.1m Ni PLATED OVERALL; BRONZE ALLOY, GOLD PLATING | COPPER ALLOYG/F 0.1m Ni PLATED OVERALL; BRONZE ALLOY, GOLD PLATING | no data! |
| Material - Housing | THERMOPLASTIC UL 94V-0, COLOR:BLACK | THERMOPLASTIC UL 94V-0, COLOR:BLACK | no data! |
| Material - Shell | STAINLESSG/F SUS304, GOLD PLATING | STAINLESSG/F SUS304, GOLD PLATING | no data! |
| Material - Lever | STAINLESSG/F SUS304, NO PLATING | STAINLESSG/F SUS304, NO PLATING | no data! |
| Material - Hinge | STAINLESSG/F SUS304, NO PLATING | STAINLESSG/F SUS304, NO PLATING | no data! |
Pin Assignment
| Pin No. | Pin NAME | Type | Description |
|---|---|---|---|
| C | VCC | 1 | |
| C | RST | 1 | |
| C | CLK | 1 | |
| C | Reserved | 1 | |
| C | GND | 1 | |
| C | VPP | 1 | VPP |
| C | I/O | 1 | / |
| C | Reserved | 1 |
Handling and Disposal Information
This product is not hazardous waste and should be handed over to a recycling processor for recycling and reprocessing. When transporting, avoid direct contact with water, acidic or alkaline chemicals, or environments containing such gases. Be aware of the risk of falling or tipping. Avoid collision or extrusion during transportation. Maintain moderate temperature and humidity (normal temperature 25, humidity within 50%) to prevent material deformation or oxidation.
Disclaimer
- The company reserves the right of final interpretation.
- Leaked and reproduced documents are prohibited.
- Unauthorized modifications are invalid.
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