SHOU HAN NANO SIM 7P H1.37
Price:
Negotiable
MOQ:
20
Delivery Time:
1工作日
Brand:
NANO SIM 7P H1.37
Product Description
Product Overview
Function: Detects the insertion of a SIM card.
Usage: Used in electronic devices to interface with SIM cards.
Notes:
- Material: Housing: High Temperature Thermoplastic, Terminal: Copper Alloy, Shell: Stainless Steel.
- Plating: Terminal: 50u" Ni Underplated Overall G/F Plated On Contact Area G/F Plated On Solder Area; Shell: 30u" Ni Underplated Overall G/F Plated On Contact Area And older Area.
Technical Specialty:
- Rated Voltage: 30V
- Current Rating: 0.5A
- Insulation Resistance: 1000M Min.
- Contact Resistance: 100m Max.
- Withstanding Voltage: 500V DC For 1 Minute.
- Operating Temperature: -40+75
- Humidity: 80% R.H Max.
Brand
SHENZHEN SHOUHAN TECHNOLOGY CO.,LTD
Origin
China
Part Number
NANO SIM 7P H1.37
Certifications
RoHS
Package Type
Tray or Carrier Tape (as per purchase order)
| Item | Requirements | Test Methods |
|---|---|---|
| Confirmation of Product | Product shall be conforming to the requirements of applicable product drawing. | Visually, dimensions and functionally inspected per applicable product drawing. |
| Contact resistance (Low Level) | Max. initial 100m | Subject mated contacts assembled in housing to closed circuit of 10 mA max. at open circuit voltage of 20 mV max. |
| Insulation resistance | Min. 1000 M | Measure by applying test potential between the adjacent contacts, and between the contacts and ground in the mated connector. MIL-STD-202, Method 302, Condition B (500 V DC10%). |
| Dielectric Strength | 500 V AC for 1 minute. Current leakage must be 1.0 mA max. | Measure by applying test potential between the adjacent contacts, and between the contacts and ground in the mated connector. MIL-STD-202, Method 301. |
| Durability (Repeated Mating/Unmating) | Contact Resistance: 100 m Max. after testing | Mate and unmate connector for 1500 cycles. |
| Temperature rise | 30 C Max. | Carry rated current load. 0.3A per contact. (UL498) |
| Vibration Sinusoidal Low Frequency | No electrical discontinuity greater then 1 sec (s) shall occur. Contact resistance: 100 m max. | Subject mated connector to 10-55-10 Hz traversed in 1 minute at 1.5 mm amplitude 2 hours each of 3 mutually perpendicular plane, 10 mA applied. MIL-STD-202, Method 201. |
| Shock | No electrical discontinuity greater than 1 sec. shall occur. No damage to product. | Applying an appropriate holder is allowed in vibration test and shock test. MIL-STD-202, Method 213, 490 m/s, 3 axes. |
| Thermal shock | No damage, Contact Resistance (Low Level) (Final) 100 m max. | Temperature range from -55C to +85C. Start from -55C. After 30 min. change to +85C, change time is no more than 30 seconds. Total 5 cycles. MIL-STD-202, Method 107D, condition A. |
| Humidity | No damage, Contact Resistance (Low Level) (Final) 100 m max. Dielectric Strength should be OK, Insulation Resistance should be 100 M min. | Temperature: 40 2 C 96 hours. Relative humidity: 90-95%; Duration: 96 Hours. MIL-STD-202, Method 103. |
| Solderability | Appearance of the specimen shall be inspected after the test with the assistance of a magnifier capable of giving a magnification of 10 X for any damage such as pinholes, void or rough surface. | Soldering time: 3 to 5 Seconds. Temperature: 2505C. |
| Resistance to soldering heat | No damage | Leave subject product |
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Company
Shenzhen ECER Network Technology Co., Ltd.
Location
Unit A2603, One Avenue (South Zone), Zhuoyue Meilin Center Plaza, No. 126 Zhongkang Road, Meidu Community, Meilin Subdistrict, Futian District, Shenzhen
Contact Person
Sellina