SHETIME TFN31-S1S1-2000-A
Price:
Negotiable
MOQ:
1000
Delivery Time:
3-5工作日
Brand:
TFN31-S1S1-2000-A
Product Description
Product Overview
This product specification defines the product performance and the test methods to ascertain the performance of the T-FLASH CARD CONN., which is designed and manufactured by Compeny. This product is a T-Flash Card Connector (TFC) designed for integration into electronic devices.
Brand GYUEDA ELECTRONICS
Origin Taiwan (Factory), Dongguan (China Factory)
Part Number TFN31-S1S1-2000-A
Description TF Card Internal Welding Type C
Material Compliance RoHS compliant
Certifications UL498
| Item | Requirements | Test Methods |
|---|---|---|
| Confirmation of Product | Product shall be conforming to the requirements of applicable product drawing. | Visually, dimensions and functionally inspected per applicable product drawing. |
| Contact resistance (Low Level) | 80 m Max. initial | Subject mated contacts assembled in housing to closed circuit of 10 mA max. at open circuit voltage of 20 mV max. |
| Insulation resistance | 1000 M Min. | Measure by applying test potential between the adjacent contacts, and between the contacts and ground in the mated connector. MIL-STD-202, Method 302, Condition B (500 V DC10%). |
| Dielectric Strength | Connector must withstand test potential of 500 V AC for 1 minute. Current leakage must be 1.0 mA max.. | Measure by applying test potential between the adjacent contacts, and between the contacts and ground in the mated connector. MIL-STD-202, Method 301. |
| Durability (Repeated Mating/Unmating) | Contact Resistance: 100 m Max. after testing | Mate and unmate connector for 5000 cycle. |
| Temperature rise | 30C Max. | Carry rated current load. 0.3A per contact. (UL498) |
| Vibration Sinusoidal Low Frequency | No electrical discontinuity greater then 1 sec (s) shall occur. Contact resistance: 100 mmax. | Subject mated connector to 10-55-10 Hz tra |
| Parameter | Specification |
|---|---|
| Storage Temperature | -25~+85 |
| Storage Relative Humidity | 80% |
| Solderability Standard | MIL-STD-202F |
| Wave Soldering Preheat Temp Increase | Not to exceed 4/sec |
| Wave Soldering Final Preheat Temp | Within 125 of solder temperature |
| Wave Soldering Temperature | 250 for a maximum of 5 seconds |
| Wave Soldering Cool Down | Ambient air at approximately 20 to 25 |
| Infrared Reflow Preheat Temp Increase | Not to exceed 4/sec |
| Infrared Reflow Max Time Above 183 | 90 seconds |
| Infrared Reflow Max Temperature | 260, not to exceed 10 seconds |
| Infrared Reflow Cool Down Rate | Not to exceed 6/sec |
| Cleaning - Aqueous Cleaning Cycles | Three cycles |
| Cleaning - Water Temperature | 54 to 66 |
| Cleaning - Water Pressure | Maximum of 30 psi |
| Cleaning - Air Drying Time | 60 to 90 seconds |
| Cleaning - Drying Temperature | 93 to 121 |
| Reference Document | Description |
|---|---|
| MIL-STD-1344A | Test method for electrical connector |
| MIL-STD-202F | Test method for electrical components |
| EIA364 | Test method for electrical components |
| JIS C 0051 | Test method for electrical components |
| MIL-G-45204C | Specification for gold plating |
| IEC-512-3 | IEC standard for current carrying capacity tests |
| QQ-N-290A | Specification for nickel plating |
| MIL-P-81728A | Specification for tin/lead plating |
| MIL-T-10727B | Specification for tin plating |
| UL498 | UL standard for safety of attachment plug and receptacle |
| EN/ISO5961 | Determination of total lead & cadmium content |
| EN1122 | Determination of total lead & cadmium content |
| EN13346 | Determination of heavy metals content |
| EPA3052 | Determination of total lead & cadmium content |
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Company
Shenzhen ECER Network Technology Co., Ltd.
Location
Unit A2603, One Avenue (South Zone), Zhuoyue Meilin Center Plaza, No. 126 Zhongkang Road, Meidu Community, Meilin Subdistrict, Futian District, Shenzhen
Contact Person
Sellina