TE Connectivity 1658670-1
Price:
Negotiable
MOQ:
10
Delivery Time:
1工作日
Brand:
1658670-1
Product Description
Product Information
This document outlines specifications for a tin-lead plated area, detailing requirements for bright tin-lead plate area over nickel (Ni) or copper (Cu) substrates. It specifies minimum thickness requirements for the tin-lead layer and underlying nickel plating, along with localized plate area requirements.
Material Tin-Lead Plate
Substrate Nickel (Ni) or Copper (Cu)
| Specification | Min Thickness (in) | Min Thickness (m) |
|---|---|---|
| Bright Tin-Lead Plate Area Over Nickel (Ni) | 150 | 3.81 |
| Bright Tin-Lead Plate Area Over Copper (Cu) | 150 | 3.81 |
| Nickel Underplate (for Tin-Lead Plate) | 100 (localized) | 2.54 (localized) |
| Localized Tin-Lead Plate Area Over 0.00130" Min Nickel | 150 | 3.81 |
| Localized Tin-Lead Plate Area Over 0.00094" Min Nickel | 120 | 3.05 |
| Localized Tin-Lead Plate Area Over 0.00071" Min Nickel | 100 | 2.54 |
| Specification | Min Thickness (in) | Min Thickness (m) |
|---|---|---|
| INSULATION TRANSGE: 1.50 [0.059] DA | 150 | 3.81 |
| INSULATION TRANSGE: 2.33 [0.094] DA | 233 | 5.92 |
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Company
Shenzhen ECER Network Technology Co., Ltd.
Location
Unit A2603, One Avenue (South Zone), Zhuoyue Meilin Center Plaza, No. 126 Zhongkang Road, Meidu Community, Meilin Subdistrict, Futian District, Shenzhen
Contact Person
Sellina