TE Connectivity 1734328-1
Price:
Negotiable
MOQ:
1
Delivery Time:
1工作日
Brand:
1734328-1
Product Description
Product Overview
This specification covers performance, tests, and quality requirements for the MINI USB CONNECTOR SERIES. Designed for reliable electrical, mechanical, and environmental performance.
Product Attributes
- Brand: Tyco Electronics
- Origin: Taipei, Taiwan
- Housing Material: Thermoplastic, UL94V-0
- Contact Material: Copper Alloy, Gold plating on contact area, Tin-lead or Tin plated on soldertails, Nickel underplated all over
- Front Shell Material: Copper Alloy, Nickel plated over Cu underplated all over
- Rear Shell Material: Steel, Tin plated over Nickel underplated all over
Technical Specifications
| Specification | Details | Reference |
| Current Rating | 1.0 Ampere | |
| Voltage Rating | 30 VAC RMS Max. | |
| Operating Temperature | -40C to +85C | |
| Low Level Contact Resistance | Initial: 50 m Max. After test: 50 m Max. | EIA 364-23 |
| Insulation Resistance | Initial: 100 M Min. After test: 100 M Min. | EIA 364-21 |
| Dielectric Withstanding Voltage | 100 V AC for one minute at sea level (No flashover or insulation breakdown, Leakage current: 0.5mA Max.) | EIA 364-20 |
| Contact Capacitance | 2 pF Maximum per Contact | EIA 364-30 |
| Contact Current Rating | 1.0A at 250Vac Min. (T shall not exceed +30C) | EIA 364-70 Method B |
| Random Vibration | No discontinuity at 1sec or longer (5.35 Gs rms) | EIA 364-28 Test Condition V Test Letter A |
| Physical Shock | No discontinuity at 1sec or longer (30Gs half-sine shock pulses of 11ms duration) | EIA 364-27 Test Condition H |
| Durability | No discontinuity at 1sec or longer (5000 cycles) | EIA 364-09 |
| Connector Mating Force | 3.57Kgf (35 Newtons) Max. | EIA 364-13 |
| Connector Unmating Force | Initial: 0.71Kgf (7 Newtons) Min. After test: 0.31Kgf (3 Newtons) Min. | EIA 364-13 |
| Cable Pull-out Force | Cable shall be not dislodge from cable (40 Newtons axial load for 1 minute) | EIA 364-38 |
| Thermal Shock | Shall meet visual requirement, show no physical damage. | EIA 364-32, Test Condition I |
| Humidity Test | Shall meet visual requirement, show no physical damage. | EIA 364-31, Test Condition A Method III |
| Temperature Life | Shall meet visual requirement, show no physical damage. | EIA 364-17 Test Condition 3 Method A |
| Solderability | The inspected area of each lead must have 95% solder coverage minimum. | |
| Steam Aging Preconditioning | (1) TinTin-Cu Coating: 93+3/-5100%RH8hrs. (2) Other Coating: 93+3/-5100%RH1hrs. | J-STD-002 category 3/2 aging |
| Resistance to Wave Soldering Heat | No physical damage shall occur. (Solder Temp.: 240+/-5, 10+2/-0sec. for PBT; 265+/-5, 10+2/-0sec. for PA9T) | |
| Resistance to Reflow Soldering Heat | No physical damage shall occur. (Peak Temp.: 260+0/-5, 20~40sec. Duration: 3 cycles) | Tyco spec. 109-201, Condition B |
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Company
Shenzhen ECER Network Technology Co., Ltd.
Location
Unit A2603, One Avenue (South Zone), Zhuoyue Meilin Center Plaza, No. 126 Zhongkang Road, Meidu Community, Meilin Subdistrict, Futian District, Shenzhen
Contact Person
Sellina