SHOU HAN USB-MICRO XNJ JB
Price:
Negotiable
MOQ:
20
Delivery Time:
1工作日
Brand:
USB-MICRO XNJ JB
Product Description
Product Overview
This specification document outlines the details for the USB-MICRO XNJ JB product from Shenzhen Shouhan Technology Co., Ltd. It covers material composition, mechanical, electrical, and environmental performance specifications, along with testing methods and standards.
Product Attributes
- Brand: SHOUHAN
- Origin: Shenzhen, China
- Company: Shenzhen Shouhan Technology Co., Ltd.
- Product Name: USB-MICRO XNJ JB
- Part Number: USB-MICRO XNJ JB
- Material Code: 4
Technical Specifications
| Test Item | Specification and Standard | Test Method and Reference Standard |
| Material Details | Plastic Part: LCP UL94V-0 | |
| Contact Terminal Part: C5191-EH, Nickel base, Gold plated contact area 1 | ||
| Shell Part: H65, Nickel plated base 50, Tin plated 80 | ||
| Mechanical Performance | Insertion Force: 3.0kgf MAX | Reference: EIA 364-13A (Insertion force when mating with cable end at 25mm/min speed) |
| Extraction Force: 0.7~1.8 kgf MIN | Reference: EIA 364-13A (Extraction force when mating with cable end at 25mm/min speed) | |
| Terminal Single PIN Holding Force: 0.5 kgf MIN | Reference: EIA 364-09A (Force for contact PIN to withdraw from plastic at 25mm/min speed) | |
| Durability Test: 3000 cycles | Reference: EIA 364-28A (Uniform insertion and extraction at 600 cycles per hour) | |
| Electrical Performance | Contact Resistance: 50m MAX | Reference: EIA 364-23A (Test contact resistance of product contact area with low power current) |
| Insulation Resistance: 100M MIN | 100V DC | |
| Withstanding Voltage Test: 300V AC 1 minute 0.5mA | Reference: EIA 364-20A (Test plastic withstand voltage between contact pins for 1 minute with 0.5mA current) | |
| Plastic Impedance between adjacent contact pins: 100M MIN | Reference: EIA 364-21A (Test plastic impedance value between adjacent contact pins with 0.5mA current) | |
| Working Current: 1.0 Ampere | ||
| Environmental Performance | Tin Adhesion: Tin adhesion area reaches over 95% | Product welding area immersed in tin furnace at 2355 for 50.5 seconds. Reference: MIL STD-202F |
| High Temperature Resistance: No obvious damage to appearance | Place product in 85 high-temperature oven for 96 hours, then place at room temperature for 3 hours for observation. Reference: MIL STD-1344A | |
| Low Temperature Resistance: No obvious damage to appearance | Place product in -40 low-temperature oven for 96 hours, then place at room temperature for 3 hours for observation. Reference: MIL STD-1344A | |
| Humidity Resistance: No obvious damage to appearance | Place product in an environment of 402 and 9095RH for 120 hours, then observe. Reference: EIA 364-31A | |
| Corrosion Resistance: No obvious corrosion | Place product in a salt spray chamber with 5% salt water concentration at 352 for continuous spraying for 12 hours, then place at room temperature for 1 hour for observation. Reference: EIA 364-26A | |
| Solderability: No obvious discoloration or blistering; smooth solder joints | Recommended reflow curve: ... (Details not fully provided in source) | |
| Working Conditions | Operating Temperature: -30+80 | |
| Vibration Test | Continuous testing for 2 hours in X/Y/Z directions, frequency from 10HZ to 55HZ and back to 10HZ per minute, amplitude 1.5mm. Reference: EIA 364-28A |
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Company
Shenzhen ECER Network Technology Co., Ltd.
Location
Unit A2603, One Avenue (South Zone), Zhuoyue Meilin Center Plaza, No. 126 Zhongkang Road, Meidu Community, Meilin Subdistrict, Futian District, Shenzhen
Contact Person
Sellina