HOAUC HYCW55-LVDS30-230B
Price:
Negotiable
MOQ:
1000
Delivery Time:
5-7工作日
Brand:
HYCW55-LVDS30-230B
Product Description
Product Details
This document outlines the technical specifications and recommended PCB layout for a component. Key features include material composition for housing, terminals, and shell, with specific plating and thickness requirements. It also addresses product warpage and component mounting restrictions in specific areas.
HOUSING
LCP BLACK UL94V-0
TERMINAL
COPPER ALLOY /Au 3u MIN ON CONTACT AREA AND SELECTIVE Au 1u MIN SOLDERING AREA OVER Ni 50u MIN
SHELL
COPPER ALLOY /Au OVER Ni 50u MIN
TOLERANCE
X 0.30, X 0.38, XXXX 0.15
| Dimension | Value (mm) | Tolerance (mm) |
|---|---|---|
| 6.70 | 0.10 | |
| 19.47 | 0.15 | |
| 21.25 | 0.15 | |
| 16.30 | 0.05 | |
| 14.50 | 0.03 | |
| 0.55 | 0.10 | |
| 15.60 | 0.10 | |
| 18.30 | 0.05 | |
| 23.20 | 0.10 | |
| 0.55 | 0.15 |
| Specification | Value |
|---|---|
| Maximum Warpage | 0.10mm |
| Note on Plug with Pull-Bar | Cannot mount another component in this area. |
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Company
Shenzhen ECER Network Technology Co., Ltd.
Location
Unit A2603, One Avenue (South Zone), Zhuoyue Meilin Center Plaza, No. 126 Zhongkang Road, Meidu Community, Meilin Subdistrict, Futian District, Shenzhen
Contact Person
Sellina