Shenzhen ECER Network Technology Co., Ltd.
                                                                                                           
Verified Supplier
17 Years
Since 2009
Menu

3M CP2-SB110-G1-FJ

Price Negotiable
Price: Negotiable
MOQ: 560
Delivery Time: 15-21周
Brand: CP2-SB110-G1-FJ
Product Description

3M CP2 Press-Fit Socket 2 mm Type B, 95, 110, and 125 Signal Contacts, Right Angle CP2 Series

The 3M CP2 Press-Fit Socket is a right-angle connector designed for high signal density at a low cost, featuring a 2 mm grid spacing. It utilizes an "Eye of the Needle" compliant pin press-fit design to reduce manufacturing time and cost. An additional grounding row is available for improved ground bounce and EMI immunity. This module is designed according to IEC 61076-4-101 and IEC 60352-5 standards. It mates with 5-row 3M HM and CP2 Headers and is end-to-end stackable with various 5-row 3M sockets. It is not suitable for stand-alone use.

Brand3M
SeriesCP2 Series
TypePress-Fit Socket, Right Angle
Grid Spacing2 mm
Standards ComplianceIEC 61076-4-101, IEC 60352-5
Insulation MaterialHigh Temperature Thermoplastic (LCP)
Contact MaterialCopper Alloy
FlammabilityUL94V-0
Mating/Un-mating Operations200 (for KR plating)
Temperature Rating-55C to +125C
ModelSignal Contact QuantityDimension A (mm)Dimension B (mm)Shield OptionsPlating Options
CP2-SBXXX-X1-XXXX9538.0036.00G= Upper Shield / Blank= No ShieldFJ= 10~20 Gold Contact Area, 100~200 Matte Tin, 50~80 Nickel Underplate
CP2-SBXXX-X1-XXXX11044.0042.00G= Upper Shield / Blank= No ShieldFJ= 10~20 Gold Contact Area, 100~200 Matte Tin, 50~80 Nickel Underplate
CP2-SBXXX-X1-XXXX12550.0048.00G= Upper Shield / Blank= No ShieldFJ= 10~20 Gold Contact Area, 100~200 Matte Tin, 50~80 Nickel Underplate
CP2-SBXXX-X1-XXXX9538.0036.00G= Upper Shield / Blank= No ShieldKR= 30~40 Gold Contact Area, 100~200 Matte Tin, 50~80 Nickel Underplate
CP2-SBXXX-X1-XXXX11044.0042.00G= Upper Shield / Blank= No ShieldKR= 30~40 Gold Contact Area, 100~200 Matte Tin, 50~80 Nickel Underplate
CP2-SBXXX-X1-XXXX12550.0048.00G= Upper Shield / Blank= No ShieldKR= 30~40 Gold Contact Area, 100~200 Matte Tin, 50~80 Nickel Underplate
SpecificationValue
Basic System Unit25 mm
Module Size50 mm
Current Rating1.0 Amperes at 70C (with all contacts powered)
Contact Resistance 20 m
Insulation Resistance 10,000 M
Test Voltage750 VACRMS
Recommended PCB Plated Through Hole Diameter 0.60.05 mm
Drill Hole Diameter 0.70.02 mm
PCB Thickness1.4 - 4.2 mm
Press-In Force 204 N/pin (on nominal hole diameter)
Retention Force 13.5 N/pin (on nominal hole diameter)
Mating Force 0.75 N/PIN
Withdrawal Force 0.15 N/PIN

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Shenzhen ECER Network Technology Co., Ltd.
Location Unit A2603, One Avenue (South Zone), Zhuoyue Meilin Center Plaza, No. 126 Zhongkang Road, Meidu Community, Meilin Subdistrict, Futian District, Shenzhen
Contact Person Sellina

Request A Quote

Please check your email address.
Your message must be at least 20 characters.