3M CP2-HB110-GA1-KR
Price:
Negotiable
MOQ:
576
Delivery Time:
15-21周
Brand:
CP2-HB110-GA1-KR
Product Description
3M CP2 Press-Fit Header
The 3M CP2 Press-Fit Header, part of the CP2 Series, offers a 2 mm grid spacing for high signal density at a low cost. It features an "Eye of the Needle" compliant pin press-fit design to reduce manufacturing time and cost. With three contact mating levels, it supports Early Mate Late Break or "Hot Swap" applications. Feed-through termination is available for mid-plane applications, and additional grounding rows can be added for improved ground bounce and EMI immunity. This header mates with 5-row 3M HSHM, UHM, and CP2 Sockets and is end-to-end stackable with 5-row 3M HSHM, HSM, HM, and CP2 Headers.
Key Features:
- 25 mm basic system unit
- 38, 44, and 50 mm module options
- 2 mm grid spacing for high signal density
- "Eye of the Needle" compliant pin press-fit design
- Three contact mating levels for EMLB/Hot Swap
- Feed-through termination capability
- Optional additional grounding rows
- Mates with 5-row 3M HSHM, UHM, and CP2 Sockets
- End-to-end stackable with compatible headers
Brand
3M
Series
CP2
Product Type
Press-Fit Header
Grid Spacing
2 mm
Contact Material
Copper Alloy
Insulation Material
Glass Filled Polyester (PBT)
Flammability
UL94V-0
Temperature Rating
-55C to +125C
| Part Number Prefix | Signal Contacts | Grounding Option | Primary Tail Length | Plating Option | Connector Type | Dimension A (mm) | Dimension B (mm) | Dimension C (mm) |
|---|---|---|---|---|---|---|---|---|
| CP2-HB095 | 95 | G (with ground pins) | 3.7 mm (1) | E1-TG30 | B19 | 38.00 | 38.30 | 36.00 |
| CP2-HB095 | 95 | (Blank - without ground pins) | 3.7 mm (1) | A1-TG30 | B19 | 38.00 | 38.30 | 36.00 |
| CP2-HB095 | 95 | G (with ground pins) | 2.3 mm (2) | E1-TG30 | B19 | 38.00 | 38.30 | 36.00 |
| CP2-HB095 | 95 | G (with ground pins) | 15.8 mm (4) | GA4-KV | B19 | 38.00 | 38.30 | 36.00 |
| CP2-HB110 | 110 | G (with ground pins) | 3.7 mm (1) | E1-TG30 | B22 | 44.00 | 44.30 | 42.00 |
| CP2-HB110 | 110 | G (with ground pins) | 3.7 mm (1) | E1-TG30 | B22 | 44.00 | 44.30 | 42.00 |
| CP2-HB110 | 110 | G (with ground pins) | 3.7 mm (1) | GA1-TG30 | B22 | 44.00 | 44.30 | 42.00 |
| CP2-HB110 | 110 | G (with ground pins) | 15.8 mm (4) | GA4-KV | B22 | 44.00 | 44.30 | 42.00 |
| CP2-HB125 | 125 | (Blank - without ground pins) | 3.7 mm (1) | E1-TG30 | B25 | 50.00 | 50.30 | 48.00 |
| CP2-HB125 | 125 | G (with ground pins) | 3.7 mm (1) | E1-TG30 | B25 | 50.00 | 50.30 | 48.00 |
| CP2-HB125 | 125 | (Blank - without ground pins) | 3.7 mm (1) | A1-TG30 | B25 | 50.00 | 50.30 | 48.00 |
| CP2-HB125 | 125 | G (with ground pins) | 3.7 mm (1) | GA1-TG30 | B25 | 50.00 | 50.30 | 48.00 |
| Plating Option Code | Contact Area Plating | Tail Contact Area Plating | Underplate |
|---|---|---|---|
| FJ | 10~20 " Gold | 100~200 " Matte Tin | 50~80 " Nickel |
| KR | 30~40 " Gold | 100~200 " Matte Tin | 50~80 " Nickel |
| KV | 30-40 " Gold | Gold Flash | 50-80 " Nickel |
| Specification | Value |
|---|---|
| Mating Force | 0.75 N/PIN |
| Withdrawal Force | 0.15 N/PIN |
| Mating and Un-mating Operations | 200 (for KR plating) |
| Current Rating | 1.0 Amperes at 70C (all contacts powered) |
| Contact Resistance | 20 m |
| Insulation Resistance | 10,000 M |
| Test Voltage | 750 VACRMS |
| Recommended PCB Plated Through Hole Diameter | 0.6 0.05 mm |
| Drill Hole Diameter | 0.7 0.02 mm |
| PCB Thickness (3.7 mm tails) | 2.4 - 5.6 mm |
| PCB Thickness (2.3 mm tails) | 1.4 - 5.6 mm |
| Press-In Force | 204 N/pin (on nominal hole diameter) |
| Retention Force | 13.5 N/pin (on nominal hole diameter) |
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Company
Shenzhen ECER Network Technology Co., Ltd.
Location
Unit A2603, One Avenue (South Zone), Zhuoyue Meilin Center Plaza, No. 126 Zhongkang Road, Meidu Community, Meilin Subdistrict, Futian District, Shenzhen
Contact Person
Sellina