muRata MM8430-2610RB3
Price:
Negotiable
MOQ:
5
Delivery Time:
1工作日
Brand:
MM8430-2610RB3
Product Description
Product Overview
This product specification is applied to microwave switch coaxial connector SWD type receptacle.
Scope: Microwave switch coaxial connector SWD type receptacle.
Note: Please contact us before using any of the products in applications not described above.
Part Number
MM8430-2610B
Packaging
Bulk Package
Quantity
N/A
Part Number
MM8430-2610RA1
Packaging
178 mm dia. reel
Quantity
1000 pcs/reel
Part Number
MM8430-2610RB3
Packaging
330 mm dia. reel
Quantity
3000 pcs/reel
| Item | Specification | Test |
|---|---|---|
| Voltage Rating | 250V r.m.s. maximum | |
| Nominal Frequency Range | DC to 6GHz | |
| Nominal Impedance | 50 | |
| Temperature Rating | -40C to +90C | |
| Insulation Resistance | 500 M minimum | MIL-STD-202, Method 302 (DC 250V+/-25V, 1min) |
| Withstanding Voltage | No evidence of breakdown | MIL-STD-202, Method 301 (AC 300V+/-20V r.m.s, 1min) |
| Contact Resistance | Initial: 50mmax. (60mmax.)*1 After test: 120mmax. (130mmax.)*1 | MIL-STD-1344 Method 3002.1 (1,000Hz, 150mA max., 200V max. voltage drop) |
| Voltage Standing Wave Ratio (V.S.W.R.) | 1.2max. (DC3GHz) 1.3max. (3GHz 6GHz) | Frequency: 0.1GHz to 6.0GHz (Network Analyzer) |
| Isolation | 20dBmin. (DC3GHz) 15dBmin. (3GHz 6GHz) | Frequency: 0.1GHz to 6.0GHz (Network Analyzer) |
| Insertion Loss | 0.1dBmax. (DC3GHz) 0.2dBmax. (3GHz 6GHz) | Frequency: 0.1GHz to 6.0GHz (Network Analyzer) |
| Engage and Disengage Force | Engagement: 30N maximum Disengagement: 5N minimum - 40N maximum | |
| Connector Durability | No evidence of visual or mechanical damage and meet contact resistance and engage/disengage force specifications. | 500 cycles of mating and withdrawal (12 cycles/min maximum) |
| Adhered Force of Electrode Terminal | No excoriation of electrode terminal. | Force: 50N, Time: 5s+/-1s (Solder paste: Sn-3.0Ag-0.5Cu, Thickness: 150m) |
| Strength of PCB Bending | No excoriation of electrode terminal. | PCB Thickness: 1.6mm, Bend: 1.0mm (Solder paste: Sn-3.0Ag-0.5Cu, Thickness: 150m) |
| Solderability | At least 95% covered by a continuous new solder coating. | MIL-STD-202, Method 208 (Solder: Sn-3.0Ag-0.5Cu, Temp: 245C, Time: 3s) |
| Resistance to Soldering Heat | No evidence of mechanical damage, and meet insulation resistance, withstanding voltage and contact resistance specifications. | Reflow soldering (Measurement after 24h+/-2h) |
| Moisture Resistance | No evidence of mechanical damage, and meet insulation resistance, withstanding voltage and contact resistance specifications. | MIL-STD-202, Method 103, Test Condition B (60 C, 95% RH, 96h) |
| Thermal Shock | No evidence of mechanical damage, and meet insulation resistance, withstanding voltage and contact resistance specifications. | MIL-STD-202, Method 107 (50 cycles: -40C to 90C) |
| Vibration | No electrical interruption exceeding 10s and no evidence of visual or mechanical damage and meet the requirement of the center contact resistance. | 3 mutually perpendicular directions (10Hz100Hz10Hz, 3mm peak to peak / 60m/s2) |
| Mechanical Shock | No electrical interruption exceeding 10s and no evidence of visual or mechanical damage and meet the requirement of the center contact resistance. | MIL-STD-202, Method 213, Test Condition B (750m/s2, 6ms, Half-sine) |
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Company
Shenzhen ECER Network Technology Co., Ltd.
Location
Unit A2603, One Avenue (South Zone), Zhuoyue Meilin Center Plaza, No. 126 Zhongkang Road, Meidu Community, Meilin Subdistrict, Futian District, Shenzhen
Contact Person
Sellina