Shenzhen ECER Network Technology Co., Ltd.
                                                                                                           
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Samtec EBDM-6-06-2.0-S-RA-1-G

Price Negotiable
Price: Negotiable
MOQ: 3
Delivery Time: 9-11周
Brand: EBDM-6-06-2.0-S-RA-1-G
Product Description

Product Overview

The EBDM-6-XX-2.0-X-RA-X-X-X is a direct mate orthogonal assembly designed for high-reliability applications. It features a 2.0mm column pitch and right-angle orientation, suitable for various board-to-board interconnects.

Product Attributes

  • Brand: SAMTEC
  • Origin: Designed & Dimensioned in Millimeters[Inches]
  • Insulator Material: LCP, UL 94-V0
  • Insulator Color: Black
  • Contact Material: Copper Alloy
  • Shield Material: Copper Alloy

Technical Specifications

Part Number PrefixNo. of Pairs per ColumnPlating SpecificationPin ConfigurationMountingOrientationColumn Pitch
EBDM-6-XX-2.0-X-RA-X-X-X-06, -08, -10, -12, *-14, *-16BLANK: NONE
-G: GUIDE PIN
-1: STANDARD
-S: GOLD ON CONTACT AREA, MATTE TIN ON TAIL
BLANK: NONE
-S: SCREW MOUNT
-RA: RIGHT ANGLE2.0: 2.0mm

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Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Shenzhen ECER Network Technology Co., Ltd.
Location Unit A2603, One Avenue (South Zone), Zhuoyue Meilin Center Plaza, No. 126 Zhongkang Road, Meidu Community, Meilin Subdistrict, Futian District, Shenzhen
Contact Person Sellina

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