3M MP2-HP08-41P1-KR
Price:
Negotiable
MOQ:
1008
Delivery Time:
10-15工作日
Brand:
MP2-HP08-41P1-KR
Product Description
Product Overview
The 3M MetPak 2-FB Power Header, MP2 Series, is a 2 mm vertical press-fit power header designed for robust interconnect solutions. It offers 6.50 Amps per contact and features an early mate late break (EMLB) function, ideal for hot-swap or selective loading applications. This header is end-to-end stackable, Futurebus+ compatible, and available with optional feed-through press-fit tails. It is RoHS Compliant.
Product Attributes
- Brand: 3M
- Product Line: MetPak
- Series: MP2 Series
- Type: 2-FB Power Header
- Termination Style: Press-Fit
- Insulation Material: High Temp LCP
- Insulation Color: Beige
- Contact Material: Copper Alloy
- Certifications: UL 94V-0, UL File No.: E68080
- Compatibility: Futurebus+ compatible
- Environmental Compliance: RoHS Compliant (RIA E1 & C1 apply)
Technical Specifications
| Specification | Details |
|---|---|
| Pitch | 2 mm |
| Rows | 4 or 5 |
| Orientation | Vertical |
| Current Rating (Power) | 6.50 A per power socket contact at 70C |
| Early Mate Late Break (EMLB) | Yes |
| Stackability | End-to-end |
| Tail Type | Press-Fit |
| Insulation Resistance | 103 M |
| Withstanding Voltage | 1,500 VAC for 60 seconds |
| Temperature Rating | -55C to +125C |
| Contact Plating (Wiping Area) | See Ordering Information |
| Solder Tails Plating | See Ordering Information |
| Press-Fit Tail Length Option | 4.60 mm [0.181 in] (Dim. A) |
| Contact Count (Example) | 08 (4 Rows), 10 (5 Rows) |
| Plating Suffix KR | 0.76 m [30 ] Min. Au Contact Area, 2.54 m [100 ] Min. Matt Whisker Mitigating Sn Tail Area, 1.27 m [50 ] Min. Ni all over |
| Plating Suffix LR | 0.08 m [3 ] Min. Au Contact Area, 0.67 m [27 ] Min. PdNi Contact Area, 2.54 m [100 ] Min. Matt Whisker Mitigating Sn Tail Area, 1.27 m [50 ] Min. Ni all over |
| PCB Hole Mounting Pattern (4 Row) | See Diagram (Sheet 4) |
| PCB Hole Mounting Pattern (5 Row) | See Diagram (Sheet 4) |
| PCB Hole Specification (KR/LR) | Finished Dia. 0.700-0.800 mm [.0276-.0315], Cu Thickness 0.025-0.045 mm [0.001-0.002], Immersion Sn 0.5 - 2.5 m [20 - 100 ], Electrolytic Au 0.1 - 0.5 m [4 - 20 ], OSP ENTEK 0.2 - 0.5 m [8 - 20 ], Drilled Hole Dia. 0.830-0.860 mm [.0330- .0340] or 0.85 mm [#66] |
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Company
Shenzhen ECER Network Technology Co., Ltd.
Location
Unit A2603, One Avenue (South Zone), Zhuoyue Meilin Center Plaza, No. 126 Zhongkang Road, Meidu Community, Meilin Subdistrict, Futian District, Shenzhen
Contact Person
Sellina