P0310 SiC Polishing Liquid - Nanoscale Wafer Planarization | POLISHER

P0310 Semiconductor / SiC Polishing Liquid

Potassium Permanganate-Based System for Nanoscale SiC Wafer Planarization

POLISHER P0310 Polishing Liquid is specifically formulated for polishing silicon carbide (SiC) wafers, combining a potassium permanganate-based system with imported alumina abrasives to achieve high polishing efficiency and nanoscale planarization.

Key Features:

• Potassium Permanganate System – Chemical-mechanical formulation engineered specifically for the demanding requirements of SiC wafer processing
• Imported Alumina Abrasives – High-quality alumina particles ensure consistent, dependable material removal
• High Polishing Efficiency – Delivers fast, effective processing while maintaining surface integrity
• Nanoscale Planarization – Achieves the ultra-flat surface finish required for advanced semiconductor applications
• Consistent Performance – Reliable 300nm grain size formulation for repeatable, high-precision results

Specifications:

• Pigment: Purple
• Abrasive Type: Alumina
• Grain Size: 300nm
• System: Potassium Permanganate

Applications:
Specifically designed for polishing silicon carbide (SiC) wafers in semiconductor manufacturing — ideal for applications requiring high-efficiency material removal and nanoscale surface planarization.

Certifications: Manufactured under ISO9001 Quality Management System certification.