POLISHER - P1530B Sapphire Lapping Slurry

P1530B Sapphire Lapping Slurry

Clustered Diamond Slurry for High-Removal-Rate Sapphire Grinding

POLISHER P1530B Sapphire Lapping Slurry is formulated with clustered diamond abrasives, delivering uniform particle distribution and a high material removal rate for precision sapphire processing.

Key Features:

• Clustered Diamond Formulation – High-purity diamond clusters deliver aggressive, consistent cutting performance
• Uniform Particle Distribution – Ensures even grinding action across the entire surface for predictable, repeatable results
• High Removal Rate – Efficiently processes hard sapphire material, reducing cycle time in production
• Precision Plane Processing – Specifically suited for accurate grinding of sapphire A-plane and C-plane surfaces
• Reliable Performance – Consistent grain size (30um) delivers stable, dependable grinding results batch after batch

Specifications:

• Pigment: Ash
• Abrasive Type: Diamond
• Grain Size: 30 um

Applications:
Ideal for diamond grinding of sapphire wafers — specifically formulated for precision processing of sapphire A-plane and C-plane surfaces in semiconductor and optical component manufacturing.

Certifications: Manufactured under the ISO 9001 Quality Management System.