SMT Single-Rail Flipping Machine OK-FBJ-460

I. Equipment Parameters
Model: OK-FBJ-460
Dimensions: 600*950*1500mm
Conveying Height: 900±30mm, compatible with common SMT production lines
Applicable PCB Specifications: Board width 50-460mm, maximum board length 450mm, suitable for large-size circuit boards
Power Supply: 220V/0.35KW, low power consumption and energy saving
Conveying Direction: Left/Right bidirectional selection, adaptable to different workshop production line layouts
Working Air Pressure: 4-6bar, can be used normally with ordinary workshop air sources
Equipment Weight: 160kg, lightweight and compact, flexible placement
Flipping Function: Supports 90°/180°/360° multi-angle flipping
Conveying Structure: Single-rail independent conveyor, smooth board movement without jamming

II. Equipment Features
Enclosed sheet metal conveyor The integrated gold and aluminum alloy body offers high protection, corrosion resistance, and deformation resistance, ensuring safer production in the workshop. A stepper motor paired with a ball screw lifting transmission ensures precise, quiet operation and long-term stability and durability. Equipped with a PLC intelligent control system, the machine operates smoothly with a low failure rate, suitable for continuous production over extended periods. A high-definition touchscreen interface with automatic fault diagnosis makes human-machine interaction simple and easy to learn. The hand-cranked screw width adjustment structure provides smooth and precise adjustment, adaptable to various PCB board sizes. Dual audible and visual alarms plus synchronized screen prompts enable timely fault diagnosis, reducing production line downtime losses. A standard SMEMA communication interface allows for seamless integration with upstream and downstream production lines, simplifying installation and connection.

III. Application Scenarios

Post-Installation Flipping Process: Automatic flipping after PCB insertion processing allows for separate front and back side placement, meeting the needs of double-sided electronic component assembly.

Pre-Inspection Flipping Process: Automatic flipping after surface mounting and soldering facilitates inspection of the back side circuitry and components, ensuring strict control over finished product yield.

Circuit board rework: Quickly flips the circuit board when repairing poor soldering or faulty components, facilitating the disassembly and assembly of components on the back and significantly improving rework efficiency.

Adhesive dispensing and curing flipping process: Automatically flips the circuit board after adhesive dispensing on the back, ensuring the adhesive cures naturally without dripping or damaging the dispensing effect, and seamlessly connecting to subsequent production processes.