High Density HDI Multi Layer Embedded Control Board Gold Finish
High-Density HDI Multi-Layer Embedded Control Board - Gold Finish
Complexity: This board features a high-density SoC/FPGA BGA design, surrounded by 0201 passive components, requiring extreme precision in SMT placement.
Interconnect Technology: Utilizes advanced HDI (High-Density Interconnect) with blind and buried vias to manage complex signal routing in a compact form factor.
Interface Rich: Integrated with multiple FPC/FFC connectors (J10-J26), SIM/MicroSD slots, and high-speed display interfaces.
| Feature | QHPCBA (Factory‑Direct) | Generic Platforms |
|---|---|---|
| Response Time | Direct Engineering Review | 12‑24h Customer Support Ticket |
| Production Speed | 8 Hours (SMT) | 3‑7 Days (Standard) |
| Middleman Markup | 0% (Factory Pricing) | Platform Commission Fees |
| DFM Feedback | Active & Collaborative | Automated "Reject" |
| Facility Access | Visit Our Shenzhen Factory | Virtual/Office Address |
Our factory specializes in the rapid prototyping of complex HDI boards, ensuring structural integrity and signal fidelity.
Ultra-Precision Stencil (2-Hour): Custom laser-cut stencils with nano-coating options for perfect BGA solder release.
Rapid PCB Fabrication (24-48H): Specialized supply chain for multi-layer HDI prototyping.
Expert SMT Assembly (8-Hour): Equipped with high-speed Yamaha/Pana-sonic mounters capable of 01005 component placement and X-Ray BGA inspection.
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X-Ray Inspection: 100% inspection for BGA & QFN internal soldering.
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AOI Testing: Full automated optical inspection for all SMT components.
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Impedance Control: Strict tolerance matching for high-speed differential pairs.
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Have questions about our products or want to discuss a custom order? Our team is ready to help you.