Precision MTS Bonding Jig
Price:
To be discussed
MOQ:
1
Delivery Time:
3 weeks
Brand:
OEM
Product Description
Syris Precision MTS Bonding Jig
Manufactured by Syris, this precision assembly fixture is built from hard-anodized AL6061 aluminum alloy combined with brass components, designed for high-precision bonding board testing (MTS) applications in electronics manufacturing.
Key Features:
- Material: Hard-anodized AL6061 aluminum alloy body for enhanced surface hardness, wear resistance, and durability under repeated cycling; brass inserts/bushings for precise, low-wear contact points
- Surface Treatment: Type III hard anodizing provides a dark, corrosion-resistant, electrically insulating surface finish suitable for sensitive electronic assembly environments
- Design: Multi-cavity plate structure with an intricate lattice of precision-machined through-holes and pockets for component clearance, alignment, and airflow/vacuum pathways
- Precision Contacts: Four brass rotary alignment/socket fixtures integrated into the lower section for accurate part seating and repeatable positioning
- Hardware: Captive quarter-turn fasteners with rotation-direction indicators for quick, tool-assisted mounting and removal
- Labeling: Laser-etched identification including product code (CV0014), part description, model number, QR/data matrix code for traceability, and directional orientation arrow
- Application: Used as an MTS (mechanical test system) jig for bonding board (BG bonding) testing — specifically for burn-in, functional test, or bonding process fixturing (Civet/D8X platform)
Manufacturing Capabilities:
Syris specializes in precision CNC machining and hard anodizing processes, delivering custom test and bonding fixtures with tight tolerances, mixed-material assembly (aluminum + brass), and full traceability marking for semiconductor and electronics test applications.
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Syris Precision Technology Co., Ltd
Location
Room 501, 1st R&D Building, Hongkong City University Chengdu Branch, #166 Yinhe Road, Dongsheng Street, Shuangliu, Chengdu, China
Contact Person
William Xia