Key Selling Points High-Efficiency Thermal Conduction: Adopts precision soldering of multiple high-conductivity pure copper heat pipes and copper heat absorption bases, quickly transferring heat from core heat sources such as CPU/GPU, with cooling efficiency improved by over 40% compared to traditional extrusion aluminum heat sinks. Dual Heat Source Independent Design: Supports simultaneous heat dissipation for dual chips (e.g., CPU+GPU), suitable for compact devices like game consoles and all-in-one PCs, avoiding mutual interference between heat sources. Customizable Structure: The bending angle of heat pipes, fin size, position of heat absorption base and mounting holes can be customized according to the internal space of the device, perfectly compatible with different models. Stable and Durable: Lead-free soldering process is adopted for heat pipes and fins, which is anti-oxidation and anti-vibration, no risk of liquid leakage during long-term operation, and the service life can reach more than 50,000 hours. Silent Solution: When used with low-noise fans, the noise can be controlled below 30dB while ensuring cooling performance, meeting the silent needs of gaming and office scenarios. Application Scenarios: Cooling solutions for compact devices such as desktop game consoles, all-in-one computers, industrial control hosts, and high-performance mini PCs.