Beijing Hongkun Jiasheng Technology Co., Ltd.
                                                                                                           
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8 Years
Since 2018
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Hpe Proliant Server Enterprise Class Dl325 Gen12 1U Rackmount Data Center

Price Negotiable
Price: Negotiable
MOQ: 1pcs
Delivery Time: 5-7 work days
Brand: HPE
Product Description

Hpe Proliant Server Enterprise Class Dl325 Gen12 1U Rackmount Data Center

Product Description

The HPE ProLiant Compute DL325 Gen12 is a 1U single‑socket rack server powered by 5th Gen AMD EPYC 9005 processors (up to 192 cores, 500W TDP) with 24 DDR5 DIMM slots (up to 6TB at 5200 MT/s). Delivering double the memory capacity of Gen11, it supports up to 20 EDSFF E3.S drives, 2 dual‑width 400W GPUs, and features PCIe 5.0 expansion with 2 slots + 2 OCP 3.0. With iLO 7, Silicon Root of Trust, and quantum‑resistant encryption (PQC), the DL325 Gen12 offers exceptional core density, memory bandwidth, and chip‑level security for virtualization and memory‑intensive workloads.

Key Differentiators

  • Single 5th Gen AMD EPYC 9005 (Zen 5, up to 192 cores, 500W TDP, 5 GHz)

  • 24 x DDR5 DIMM slots — up to 6TB at 5200 MT/s (double Gen11 capacity)

  • Up to 10 SFF or 20 EDSFF E3.S NVMe drives

  • Optional front panel boot device for quick access

  • Up to 2 dual‑width (400W) or 4 single‑width (75W) GPUs

  • 2 x PCIe 5.0 + 2 x OCP 3.0 slots

  • Air cooling, closed‑loop liquid cooling, or direct liquid cooling (DLC)

  • iLO 7 with Secure Enclave (dedicated security processor)

  • Silicon Root of Trust — zero‑trust chip‑level framework

  • Quantum‑resistant encryption (PQC, CNSA 2.0)

  • 1U compact chassis: 4.29 x 43.46 x 60.94 cm

  • 3‑year on‑site, next‑business‑day response

Specifications

 
 
Category Specification
Model HPE ProLiant Compute DL325 Gen12
Form Factor 1U rackmount, single‑socket
CPU 5th Gen AMD EPYC 9005 (Turin, Zen 5)
Max Cores Up to 192 cores
Max Frequency Up to 5 GHz
Max TDP 500W
Memory Slots 24 x DDR5 DIMM
Max Memory 6TB at 5200 MT/s
Front Storage Options Up to 10 SFF or 20 EDSFF E3.S
Boot Device Optional front panel boot device
GPU Support Up to 2 dual‑width (400W) or 4 single‑width (75W)
PCIe Slots 2 x PCIe 5.0 + 2 x OCP 3.0
Cooling Air, closed‑loop liquid, or DLC
Management iLO 7 (Secure Enclave, Silicon Root of Trust)
Security Quantum‑resistant encryption (PQC, CNSA 2.0)
Dimensions (HxWxD) 4.29 x 43.46 x 60.94 cm
Operating Temp 10° to 35° C
Warranty 3‑year on‑site, next‑business‑day

Unique Advantages

  • Ultra‑high core density: 192 cores in 1U — replaces multiple older servers

  • Doubled memory capacity vs. Gen11 (6TB) — optimized for memory‑intensive workloads

  • Reduces virtualization software licensing costs

  • Next‑gen chip‑level security: iLO 7 + PQC + Secure Enclave

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Beijing Hongkun Jiasheng Technology Co., Ltd.
Location Jin Yan Long Building, Changping District, Beijing, 9th floor
Contact Person Jeffrey

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