Beijing Hongkun Jiasheng Technology Co., Ltd.
                                                                                                           
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High Density H3C Server R5500 G6 8 GPU AI Training With 8x H200/H100 GPU 24x3.84TB NVMe SSD And Dual Xeon 8558+/8468 Processors

Price Negotiable
Price: Negotiable
MOQ: 1PC
Delivery Time: 5-7 work days
Brand: H3C
Product Description
H3C R5500 G6,H3C R5500 G6 8-GPU AI Training Server with 8x H200/H100 GPU 24x3.84TB NVMe SSD and Dual Xeon 8558+/8468 Processors
2x Intel Xeon 8558+/8468 CPU | 32x64GB DDR5 RAM | 24x3.84TB NVMe SSD | 8x H200/H100 GPU | OCP 3.0 Interface
 
1. Product Overview

The H3C UniServer R5500 G6 is a flagship 6U high-density 8-GPU AI training server purpose-built for large-scale generative AI model training, trillion-parameter model fine-tuning, high-performance computing (HPC), and enterprise-level massive data processing. Adopting H3C’s exclusive modular intelligent computing architecture, this server delivers ultra-high parallel computing efficiency, industry-leading local storage capacity, and flexible hardware compatibility, standing out from conventional AI servers with superior scalability and operational reliability. It is fully optimized to tackle the most demanding heavy-load AI workloads for data centers, scientific research institutions, and enterprise intelligent computing platforms.

This fully configured system supports dual Intel Xeon 8558+ / 8468 scalable processors for flexible CPU performance matching, paired with 32x64GB high-speed DDR5 ECC memory to ensure ultra-large dataset real-time processing and multi-task concurrency. It is equipped with a massive 24x3.84TB NVMe high-speed storage array, breaking the local storage bottleneck of most standard AI servers. Compatible with 8x NVIDIA H200 or H100 flagship GPUs with full high-speed interconnection, and integrated with OCP 3.0 high-efficiency expansion interface, this machine achieves comprehensive upgrades in computing power, storage capacity, expansion flexibility and operational stability, perfectly adapting to long-duration distributed AI training and high-concurrency inference scenarios.

 
2. Technical Specifications
Specification Details
Model Number H3C UniServer R5500 G6 AI Training Server
Form Factor 6U Standard Rackmount High-Density AI Server
Processor 2x Intel Xeon 8558+ / 8468 Scalable Processors (Dual CPU Optional Configuration)
System Memory 32x 64GB High-Speed DDR5 ECC Registered RAM
Storage Configuration 24x 3.84TB Enterprise-Grade High-Speed NVMe SSD (Ultra-large Local Storage Array)
GPU Configuration 8x NVIDIA H200 / H100 SXM5 High-Performance GPU Accelerators (Dual GPU Generation Compatible)
Expansion Interface OCP 3.0 High-Speed Expansion Interface, Supports Flexible Network & Acceleration Module Upgrade
Cooling System Intelligent Independent Modular Cooling System, Optimized for Long-Term 8-GPU Full-Load AI Training
Power Supply Hot-Swappable Redundant High-Power Power Module, 24/7 Uninterrupted Heavy-Duty Operation
Management System H3C Intelligent Remote Management System, Real-Time Hardware Monitoring & Fault Alarm
Core Application Large LLM Training & Fine-Tuning, Generative AI Inference, HPC Scientific Simulation, AIGC Industry Application, Massive Big Data Analysis, Cloud AI Cluster Deployment
 
3. Product Differentiation & Performance Comparison
Comparison Item H3C R5500 G6 AI Server Conventional 8U AI Servers
Computing Compatibility Dual CPU & dual GPU generation compatible, supports Xeon 8558+/8468 and H200/H100 cross configuration, flexible performance matching for diverse AI tasks Fixed single CPU and single GPU specification, poor compatibility, unable to flexibly switch training and inference workloads
Storage Capability Industry-leading 24x3.84TB NVMe ultra-large local storage array, eliminates external storage reliance, drastically reduces data transmission latency Limited NVMe storage bays, small local capacity, heavily dependent on external storage clusters, causing obvious training latency bottlenecks
Expansion Flexibility Built-in OCP 3.0 high-speed interface, supports high-performance network cards and AI acceleration module upgrades, future-proof for iterative AI workloads Single traditional PCIe expansion, lack of dedicated high-speed OCP interface, insufficient scalability for new-generation AI networks
Maintenance & Stability Modular hot-swappable design for GPU, CPU, storage, fan and power modules, fast maintenance, zero downtime for cluster operation Integrated fixed structure, complicated disassembly and maintenance, high risk of cluster operation interruption
Space & Heat Dissipation Compact 6U high-density layout, optimized dedicated cooling for multi-GPU full load, higher rack space utilization than traditional 8U models Bulky 8U structure with low space efficiency, ordinary cooling design leading to GPU thermal throttling under long full load
 
4. Compatible Matching Accessories
Accessory Name Functional Description
High-Speed OCP 3.0 Network Card Upgrade network transmission speed, adapt to large-scale AI cluster distributed training and data synchronization
Extended DDR5 Memory Module Expand system memory capacity to support larger model training and higher concurrent inference tasks
High-Performance NVMe SSD Further expand local storage space to support ultra-large-scale AI dataset local deployment
Redundant Backup Power Supply Strengthen power supply redundancy to ensure stable operation of multi-GPU heavy-load AI training for 24/7
 
5. Core Advantages & Application Scenarios
  • Dual Compatibility & Flexible Configuration: Supports dual Intel Xeon CPU generations and H200/H100 dual flagship GPU adaptation, freely matching lightweight inference and ultra-heavy large model training tasks with strong scenario adaptability
  • Industry-Leading Massive Local Storage: Equipped with 24x3.84TB NVMe high-speed storage array, realizing ultra-large dataset local storage, avoiding cross-network data transmission delay, greatly improving AI training efficiency
  • OCP 3.0 High-Speed Expandability: Dedicated OCP 3.0 high-efficiency expansion interface reserves abundant upgrade space for high-speed networking and AI acceleration, perfectly adapting to iterative upgrades of new-generation AI technologies
  • High-Density & Efficient Heat Dissipation: Advanced 6U compact high-density design saves data center rack space, while customized intelligent modular cooling completely solves heat dissipation bottlenecks of 8-GPU long-term full-load operation
  • Modular High Reliability Design: Five core modules support independent hot-swappable maintenance, effectively reducing equipment failure downtime and maintenance costs, ensuring long-term stable operation of AI computing clusters
  • Powerful Full-Load Computing Performance: Dual high-end CPUs + 8 flagship GPUs + ultra-large memory and storage combination deliver explosive parallel computing power, specially optimized for trillion-parameter LLM training, AIGC generation, scientific HPC simulation and big data intelligent analysis

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Company Beijing Hongkun Jiasheng Technology Co., Ltd.
Location Jin Yan Long Building, Changping District, Beijing, 9th floor
Contact Person Jeffrey

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