Huawei Network Equipment Cloudengine Xh9230 128dq Lc 51 2t Huawei Switch 400ge Liquid

Huawei Network Equipment Cloudengine Xh9230 128dq Lc 51 2t Huawei Switch 400ge Liquid

Product Overview

The CloudEngine XH9230-128DQ-LC delivers 128×400GE QSFP112 ports, 51.2 Tbps switching capacity, 100% liquid‑cooled main chip and optical modules, NPLB/NSLB load balancing, and AI Fabric 2.0 compatibility – doubling rack utilization for AI training clusters and intelligent computing centers.

Key Differentiators (Bulleted for Buyer Focus)

• Ultra‑High Density 400GE – 128×400GE QSFP112 ports in 4U – industry‑leading port count for spine‑leaf fabrics in large‑scale AI clusters.

• Full Liquid Cooling – Main chip + optical modules 100% liquid‑cooled; liquid cooling ratio ≥65% – reduces cooling power consumption by 50% compared to air‑cooled alternatives.

• Patented Thermal Conductive Medium – Huawei proprietary coolant ensures long‑term reliability and maintenance‑free operation in dense deployments.

• Double Rack Utilization – One rack accommodates 8 servers (industry standard is 4 servers per rack) – doubles compute density for AI training farms.

• NPLB/NSLB Load Balancing – Network‑level and path‑level load balancing algorithms eliminate congestion, ensuring optimal GPU‑to‑GPU communication for distributed training.

• AI Fabric 2.0 Compatible – Native integration with Galaxy AI Fabric 2.0 for zero‑touch provisioning, intelligent path selection, and real‑time telemetry.

• VXLAN Ready – Full VXLAN BGP EVPN support for network virtualization and multi‑tenant isolation in large‑scale data centers.

• Massive Forwarding Capacity – 51.2 Tbps switching, 19,000 Mpps forwarding rate – handles 128 ports of full‑rate 400GE traffic non‑blocking.

• Redundant Power – 2000W AC/240V DC hot‑swappable redundant power supplies for carrier‑grade reliability.

• 4U Compact Design – High port density per rack U, reducing spine switch count and inter‑rack cabling complexity.

Technical Specifications

Typical Deployments – Large‑scale AI training cluster spine/leaf fabric with 400GE GPU‑to‑GPU connectivity, intelligent computing center core layer, hyperscale data center spine‑leaf architectures, AI networking for thousands to tens of thousands of servers.