Beijing Hongkun Jiasheng Technology Co., Ltd.
                                                                                                           
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8 Years
Since 2018
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Supermicro Server 3U Rackmount Microcloud Multi Node Cloud Computing

Price Negotiable
Price: Negotiable
MOQ: 1pcs
Delivery Time: 5-7 work days
Brand: Supermicro
Product Description

Supermicro Server 3U Rackmount Microcloud Multi Node Cloud Computing

Product Description

The Supermicro MicroCloud family delivers ultra‑dense 3U rackmount servers with 5, 8, 10, or 12 independent hot‑swappable nodes — saving up to 76% rack space versus equivalent 1U servers. Each node operates independently with its own CPU, memory, storage, and networking, supporting AMD EPYC 4004/4005, Ryzen 7000/9000 (AM5), or Intel Xeon 2300 processors (up to 16 cores, 170W TDP). With front NVMe bays, PCIe 5.0 expansion, and single‑width GPU support (T4/L4/A2), the MicroCloud is purpose‑built for cloud, CDN, web hosting, virtualization, edge, and AI inference at scale.

Key Differentiators

  • 3.3× density of 1U servers: up to 12 independent nodes in 3U

  • Hot‑swappable nodes — service one without downtime to others

  • Per node: 4 x DDR5 DIMM slots, up to 192GB at 5600 MT/s

  • Per node: 2 x 3.5”/2.5” hot‑swap NVMe U.2/SAS/SATA bays + 1 x M.2 PCIe 5.0 NVMe

  • Per node: 1 x PCIe 5.0 x8 LP slot + 1 x Micro‑LP slot; supports single‑width GPU

  • Per node: 2 x 2.5GbE/10GbE RJ45 + optional 25/100GbE via Micro‑LP + dedicated BMC

  • Centralized IPMI 2.0, Redfish, KVM‑over‑LAN, TPM 2.0

  • Redundant Platinum/Titanium PSUs (96% efficiency)

Specifications

 
 
Category Details
Form Factor 3U rackmount, multi‑node
Node Configurations 5N (GPU‑capable), 8N (standard), 10N (max CPU), 12N (legacy)
CPU (per node) Single socket: AMD AM5 or Intel Xeon 2300, up to 16 cores, 170W TDP
Memory (per node) 4 x DDR5 DIMM slots, up to 192GB at 5600 MT/s
Front Storage (per node) 2 x 3.5”/2.5” hot‑swap NVMe U.2/SAS/SATA
M.2 (per node) 1 x PCIe 5.0 x4 NVMe (2280/22110, bootable)
PCIe (per node) 1 x PCIe 5.0 x8 LP + 1 x Micro‑LP; supports 1 single‑width GPU
Networking (per node) 2 x 2.5GbE/10GbE RJ45 + optional Micro‑LP (25/100GbE) + dedicated BMC
Management Centralized IPMI 2.0, Redfish, KVM‑over‑LAN, TPM 2.0
Power Supply 2 x redundant Platinum/Titanium (96% efficiency)
Dimensions (WxHxD) 447 x 130 x 711 mm (17.6 x 5.1 x 28 in)
Weight (net) ~45 kg (99 lb)

Popular Models

  • AS‑3015MR‑H5TNR – 5‑node (CPU+GPU)

  • AS‑3015MR‑H8TNR – 8‑node (AMD EPYC/Ryzen)

  • AS‑3015MR‑H10TNR – 10‑node (max CPU density)

  • SYS‑5039MC‑H8TRF – 8‑node (Intel Xeon, DDR4)

Typical Configuration (per node)

  • CPU: 1 x AMD Ryzen 9 9950X (16 cores, 170W)

  • Memory: 128GB DDR5‑5600 (4 x 32GB)

  • Storage: 1 x 960GB M.2 NVMe + 2 x 3.84TB U.2 NVMe

  • Networking: 2 x 10GbE RJ45

Ordering Notes

  • Base SKU prefix: AS‑3015MR‑xxxx (AMD) / SYS‑5039MC‑xxxx (Intel)

  • Node suffix: H5TNR (5N), H8TNR (8N), H10TNR (10N)

  • Motherboard (per node): H13SRD‑F (AMD) / X11SCD‑F (Intel)

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Beijing Hongkun Jiasheng Technology Co., Ltd.
Location Jin Yan Long Building, Changping District, Beijing, 9th floor
Contact Person Jeffrey

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