Material: Stainless Steel / Iron / Brass / Tungsten Alloy / Titanium Alloy

Surface Treatment: Plating / Polishing / Sand Blasting / Passivation

Tolerance: 0.05mm

Technology: Metal Injection Molding

Certification: ISO9001 & ISO14001

Our microchannel liquid cooling plates are fully produced via mature Metal Injection Molding (MIM) technology.

We adopt thermally conductive metal powder feedstock to fabricate intricate integrated structures, covering dense micro-hole flow channels, bent profiles, fluid connection ports, mounting cutouts and positioning holes within a single sintered component.

Benefiting from MIM’s robust near-net-shape forming capability, thousands of tiny cooling channels and complex irregular outlines take shape in one sintering process. This largely cuts down extra CNC drilling work and reduces overall manufacturing expenses for custom thermal management components. Multiple thermally conductive MIM materials are optional to retain outstanding heat transfer performance for high-power chips and optical assemblies.

The sintered blank can go through follow-up machining and polishing treatments for sealing areas. This secondary surface processing optimizes the flatness of sealing faces and avoids coolant leakage. The all-in-one integrated design eliminates redundant assembly steps and improves overall structural durability.

Our MIM cooling plates cover thermal management demands across optoelectronics, semiconductors and computing hardware. Reach out to us, and we will deliver customized MIM solutions matching your cooling device plans.