Epoxy Bonding Process Thermal Cooling Plate , Copper Tube Liquid Cold Plate

Thermal Cooling Plate Copper tube liquid cold plate with epoxy bonding process

Liquid cold plate uses a pump to circulate the coolant in the heat pipe and dissipate heat. The heat absorption part on the radiator (called the heat absorption box in the liquid cooling system) is used to dissipate heat from computer CPU, North Bridge, graphics card, lithium battery, 5G communication equipment, UPS and energy storage systems, and large photovoltaic inverters. The heat absorbed by the heat absorption part is discharged to the outside through the radiator designed on the back of the pyrogen.

In the fields of power electronic control, conversion, drive, signal transmission, and new energy fields (including new energy vehicle power battery heat dissipation, UPS and energy storage system heat dissipation, large server heat dissipation, large photovoltaic inverter heat dissipation, SVG/SVC heat dissipation, etc.), when pursuing high-efficiency, low-noise and low-temperature operation with limited space, heat dissipation becomes the biggest limitation to ideal product development. Liquid cooling technology has become the preferred thermal management method.

Winshare's thermal design and thermal management engineers have rich experience in water cooling system research and development and water thermal cooling plate process production. We provide comprehensive liquid cooling solutions, including free liquid cooling plate/water cooling plate thermal design, structural design, water channel connection, water cooling system assembly design, and one-stop supporting services.

• Quick response to all inquiries
• Guaranteed product quality with reasonable and competitive pricing
• Efficient production arrangements and timely delivery
• Optimal transportation solutions based on goods weight and volume
• Comprehensive technical support and problem resolution