Liquid Cooled Cold Plate Heat Exchanger for Custom Cold Plates Cooling
Price:
1300-1500 dollars
MOQ:
100pcs
Delivery Time:
not limited
Brand:
Uchi
Product Description
Liquid Cooled Cold Plate Heat Exchanger for Custom Cold Plates Cooling
Heat Exchanger Liquid Cooled Cold Plate
Product Specifications
Material:
AL 1100
Size:
5x7x3cm
Weight:
0.15kg
Technology:
FSW Cooling
Feature:
High cooling capability and Fast cooling
Surface Treatment:
Oil cleared, cleaned and passivation
Heat Conducting Power:
260W
Liquid Cooled Cold Plate Heat Exchanger (Cold Plate Heat Exchanger), commonly referred to as liquid cooling plate, is a high-efficiency liquid cooling heat dissipation component specially designed for high-power-density applications. By making direct contact with heat sources, it rapidly removes heat via internally flowing fluid, with heat dissipation performance far exceeding traditional air cooling.
Core Working Principle
Based on the thermodynamic principles of thermal conduction and forced convection:
Thermal Conduction & Heat Absorption
The metallic baseplate of the cold plate is tightly attached to heat-generating devices such as CPUs, GPUs, and IGBTs. Thermal Interface Material (TIM) is used to eliminate air gaps, enabling efficient heat transfer into the cold plate.
Convective Heat Transfer
Coolant (water, glycol solution, dielectric fluid, etc.) flows through precision-designed internal channels, absorbing heat from the baseplate via forced convection.
Heat Transportation
The heated coolant exits the cold plate, releases heat in an external CDU (Cooling Distribution Unit) or radiator, and is recirculated after cooling.
Main Structure & Types
Core Materials
- Copper (Cu): Extremely high thermal conductivity (~400 W/m*K), optimal heat dissipation performance, widely used for high-performance chips.
- Aluminum (Al): Low cost, lightweight, commonly applied in power batteries and industrial equipment.
Internal Channel Structures
Tube-in-Plate Liquid Cooling Plate
- Structure: Grooves machined in the metal baseplate, with copper tubes embedded and hermetically welded.
- Features: Mature manufacturing process, high pressure resistance, moderate cost.
Folded / Stacked Type (Milled & Welded)
- Structure: Complex flow channels milled into the baseplate, then sealed and welded with a cover plate.
- Features: Flexible channel design, large heat exchange area, low thermal resistance.
Micro-channel Type
- Structure: Ultra-fine flow channels (width ≤ 1 mm), providing extremely high specific surface area.
- Features: Ultra-high heat dissipation (heat flux exceeding 500 W/cm²), high pressure drop, strict requirements for coolant cleanliness.
Pin-fin / Skived Fin Type
- Structure: Integrated pin-shaped or thin fin structures formed directly from the baseplate.
- Features: No welding-induced thermal resistance, strong turbulence, high heat dissipation efficiency.
Key Performance Parameters
- Thermal Resistance (Rth): Core performance indicator, typically 0.02 ~ 0.1 ℃/W; lower value means better heat dissipation.
- Heat Dissipation Capacity: Single cold plate can handle 500W ~ 2000W+ of power.
- Pressure Drop (ΔP): Flow resistance of the coolant, affecting pump power consumption.
- Operating Pressure: Standard rated pressure 2~5 bar, burst pressure generally ≥ 8 bar.
Main Application Fields
- Data Centers / High-Performance Computing (HPC): Cooling for AI server GPUs and CPUs, supporting high-density computing power.
- New Energy Vehicles: Thermal management of power battery packs, heat dissipation for motor controller IGBTs.
- Industrial & Medical Equipment: Lasers, power inverters, medical imaging devices.
- Aerospace: High-reliability heat dissipation for radar systems, satellite payloads, etc.
Core Advantages
- High Heat Dissipation Efficiency: 10~25 times the capacity of air cooling.
- Low Noise & Energy Saving: No high-speed fan noise; system PUE can be reduced to below 1.1.
- Precise Temperature Control: Small temperature fluctuations, extending service life of electronic components.
- Compact Size: Smaller volume than air-cooled heat sinks, suitable for highly integrated equipment.
Difference from Traditional Plate Heat Exchangers
- Liquid Cooling Cold Plate: Absorbs heat from one side, mainly used for device-level / chip-level cooling with direct contact to heat sources.
- Plate Heat Exchanger (PHE): Performs heat exchange on both sides, used for system-level liquid-to-liquid / liquid-to-gas heat transfer (e.g., inside a CDU).
Core Selling Points
Performance Advantages
- Ultra-High Heat Dissipation Efficiency: With strong heat flux carrying capacity, its heat dissipation efficiency far exceeds that of air cooling in the same volume.
- Ultra-Low Thermal Resistance Design: Adopting integrated flow channel / microchannel structure to reduce welding thermal resistance.
- Precise Temperature Control & Small Temperature Difference: Uniform liquid cooling heat transfer with small temperature fluctuations.
- Adaptable to High Power Density: A single cold plate can support kilowatt-level heat dissipation.
Structural & Reliability Advantages
- Compact Structure & Space-Saving: Slim design with small footprint, facilitating equipment miniaturization.
- Pressure-Resistant Sealing & Low Leakage Risk: Mature welding / diffusion bonding technology ensures strong pressure resistance.
- Selectable Materials & Wide Scenario Adaptability: Lightweight aluminum or high-thermal-conductivity copper.
- Highly Customizable Flow Channels: Flow channels can be designed according to heat source layout.
Application & System Advantages
- Silent & Noise-Free: No noise from high-speed fans, ideal for environments with high silence requirements.
- Energy Saving & Consumption Reduction: High heat exchange efficiency lowers overall energy consumption.
- Dust & Contamination Resistance & Easy Maintenance: Closed liquid cooling loop is immune to dust and oil.
Application Scenario Advantages
- Universal for Multiple Fields: Suitable for new energy vehicles, AI servers, laser equipment, and medical instruments.
- Strong Adaptability to High-Temperature Environments: Less affected by ambient temperature compared with air cooling.
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Dongguan Uchi Electronics Co.,Ltd
Location
Room 810, Unit 2, Building 5, Huixing Commercial Center, Dongsheng Road No.1, Zhongshan Dong, Shilong Town Dongguan
Contact Person
Anna