Custom 8 Layer PCB

Custom 8 Layer PCB for Complex Multilayer Designs

Huayihai manufactures custom 8 layer PCBs for designs that outgrow four and six layers: dense BGA fanout, split power planes, and controlled-impedance signal routing. Boards are produced according to customer Gerber files and stack-up requirements.

At eight layers, stack-up execution becomes increasingly important for signal integrity, power distribution, and impedance consistency. Our process holds 3/3 mil trace and spacing, impedance control to ±5%, and copper up to 6 oz, verified to IPC-A-600 and 100% electrical testing before shipment.

Custom Manufacturing Only

We provide 8 layer PCB manufacturing according to customer Gerber files and technical specifications. We do not supply ready-made or standard products.

Product Specifications

Key Features

• Dedicated 8 layer fabrication within a 2–64 layer capability

• 3/3 mil trace and spacing on both prototypes and volume runs

• Controlled impedance to ±5% tolerance

• HDI options up to 2+n+2 with 3 mil laser microvias

• Heavy copper option up to 6 oz

• 100% electrical testing on every board

Manufacturing Highlights

An 8 layer board lives or dies by stack-up execution: lamination registration, layer-to-layer alignment, and impedance consistency across the panel. These are verified in-process, not just at final inspection.

Key service elements include:

• Stack-up and impedance review during engineering stage

• Controlled lamination and registration

• 3/3 mil line etch capability

• Impedance verification to ±5%

• 100% electrical testing before shipment

Typical Applications

8 layer boards commonly serve designs with dense routing and dedicated planes:

• Industrial Control Systems

• Communication Equipment

• Automotive Electronics

• Medical Devices

• Power Conversion and Drives

• Other 8 Layer PCB Projects

Why Choose Huayihai

• Over 20 years of PCB manufacturing experience

• 2–64 layer capability with 8 layer as a standard program

• 3/3 mil trace and spacing, ±5% impedance control

• Prototype and mass production on the same process

• Fabrication and assembly available from one partner

• Quality management based on ISO 9001, ISO 13485, IATF 16949 and UL

Manufacturing Process

• Gerber file and stack-up review

• Inner layer imaging and etch

• Lamination and registration control

• Drilling, plating, and outer layer imaging

• Solder mask, surface finish, and silkscreen

• Electrical test, final inspection, and shipment

FAQ

Q1: Can you build 8 layer boards with HDI?

Yes, HDI up to 2+n+2 with 3 mil laser microvias is available.

Q2: Can the 8 layer board include impedance control?

Yes, impedance is controlled to ±5% tolerance per your stack-up.

Q3: What materials can be used?

FR-4, Hi-Tg, Rogers, and other materials per customer requirement.

Q4: What is the standard lead time?

3–5 working days for prototypes and batch production, after file review is complete.

Q5: Can you assemble the 8 layer board as well?

Yes, SMT and through-hole assembly are available in the same factory.

Request a Quote

Need a custom 8 layer PCB with controlled impedance?

Send us your Gerber files and stack-up requirements for a quotation. Learn more at nexuspcba.com.