Hans Hi Technology (Shenzhen) Co., Ltd.
                                                                                                           
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10 Years
Since 2016
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E-KYC Enrollment USB 2.0 IP65 Fingerprint Modules Signature Capture

Price Negotiable
Price: USD 200-400 / Piece
MOQ: 100 Pieces
Delivery Time: 15-30 days after order confirmation
Brand: OEM
Product Description

A910S FBI FAP 60 Fingerprint Module with Signature Capture

One compact device for compliant fingerprint and signature enrollment in e-KYC workflows.

Built for e-KYC & Identity Enrollment

  • FBI FAP 60 Certified — Compliant with FBI Appendix F for 4-4-2 fingerprint capture.
  • 4-4-2 Flat & Rolled Prints — Slap capture at 1600 x 1500 and single flats/rolls at 800 x 750 pixels, 500dpi or higher.
  • Integrated Electromagnetic Signature Pad — 2540 LPI, 1024 pressure levels, +/-0.5mm accuracy; no separate pad required.
  • Live Finger Detection — Helps prevent spoofing and protects enrollment integrity.
  • USB 2.0 + SDK — Windows, Android and Linux SDKs for quick workstation and kiosk integration.

Specifications

Certification FBI Appendix F FAP 60, FCC, CE, RoHS
Sensor Optical, platen 86 x 76.2mm
Fingerprint Image Slap 1600 x 1500; flats/rolls 800 x 750; ≥500dpi, 8-bit
Signature Electromagnetic, 2540 LPI, 1024 levels
Interface USB 2.0
Protection IP65, 9H surface hardness

Suited to banking e-KYC, telecom SIM registration and digital onboarding. Contact us for samples and SDK documentation.

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Hans Hi Technology (Shenzhen) Co., Ltd.
Location No. 708, Building 16, South Bank, Convention and Exhibition Bay, Fuhai Street,Baoan District, Shenzhen, China
Contact Person Hami

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