0.08 mm Round Die Cut Polyimide Adhesive Tape with 250 Centigrade Resistance
Price:
Negotiable
MOQ:
100pcs
Delivery Time:
7-10work days
Brand:
HB
Product Description
0.08 Mm Round Die Cut Adhesive Tape Polyimide 250 Centigrade Resistant
PI tape consists of polyimide and silicon PSAs, which required fluoroplastic film when die-cutting. The coating precison reaches ±2.5μm without scratch. This product, with hight temperature resistance and good chemical resistance, suits for SMT PCBA, battery, high-level appliance, voltage transformer and motor insulation.
Storage temprature: 5-25℃, relative humidity 65% dry place, avoid sunshine.
High temperature tape example:
| glue | siloxane adhesive | composition | PoIyimide | 25microns |
| glue thickness | 40microns | total thickness | 65microns | |
| color | amber etc. | usage | PCBA | |
| item | unit | data | remarks | |
|---|---|---|---|---|
| peeling force | g/in | 50+/-50 | ||
| tensil stress | MD | % | 60 | |
| TD | % | 60 | ||
| heat resistance | excellent | 260°/30minutes | ||
| solubility | good | 20%HCL,NaOH/20hours | ||
| expansion force | Kg/in | 8 | ||
Similar Products
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Dongguan HuiBing Adhesive Products Co., Ltd
Location
No.11 Xiangyi 1st Road, Dalang Town, Dongguan City, Guangdong Province
Contact Person
SunBing