Ultra Thin Kapton Polyimide Tape 0.05mm Silicone Adhesive for SMT PCB Gold Finger Masking

Ultra Thin Kapton Tape is a 0.05 mm polyimide (PI) tape coated with silicone adhesive, engineered for precision PCB gold finger masking in SMT and fine-pitch board assembly. The ultra-thin profile follows micro-contour surfaces closely, delivers razor-sharp masking edges, and prevents solder wicking onto gold fingers during reflow and wave soldering. It removes cleanly without residue, protecting board yield and contact reliability.

• Ultra-thin 0.05 mm profile for fine-pitch and micro-contour masking
• Razor-sharp masking edges, no solder wicking on gold fingers
• Continuous 260°C resistance, short-term up to 400°C
• Zero residue peel even after multiple thermal cycles
• Excellent conformability around vias, pads and edge bevels
• Stable unwind and slitting performance for automated lines

• SMT PCB gold finger masking and selective soldering
• Fine-pitch connector and edge card protection
• HASL and reflow soldering shielding
• High-density board assembly and die-cutting processes
• Insulation for thin-film electronic components

• Precision die-cutting to customer drawings
• Custom width slitting from 3 mm to 500 mm
• Custom lengths up to 200 m per roll on request

• Factory direct supply, competitive wholesale pricing
• Custom width slitting from 3 mm to 500 mm
• Stable batch consistency with strict QC on adhesion and thickness
• OEM & ODM service: custom logo on rolls, cores and cartons