Precision Engineering Aluminum Nitride Ceramics High Thermal Conductivity Aluminum Nitride Heat Sink
High Thermal Conductivity Precision Engineering Aluminum Nitride(ALN) Heat Sinks
Aluminum Nitride, formula AlN, is a newer material in the technical ceramics family, and a covalently bonded material with hexagonal crystal structure.AlN has excellent thermal, mechanical and electrical properties, such as high thermal conductivity, low dielectric constant, high electrical resistivity, low density and a thermal expansion coefficient that matches well with that of silicon.
Aluminum Nitride (AlN) ceramic parts deliver exceptionally high thermal conductivity and excellent electrical insulation. Widely used across power electronics and semiconductor equipment, AlN acts as a non-toxic replacement for Beryllium Oxide (BeO). It is primarily fabricated into substrates, crucibles, electrostatic chucks, and customized structural components.
Made of high‑performance aluminum nitride ceramic, this heat sink features high thermal conductivity and excellent electrical insulation. Its thermal expansion coefficient closely matches silicon chips, reducing thermal‑cycle stress for long‑term reliability. Precision‑machined for custom dimensions, it delivers efficient heat dissipation for power electronics, semiconductors and high‑power LED devices.
| AlN Materials Properties | Aluminum Nitride |
| Purity | 95%-99% |
| Density | 3.3g/cm3 |
| Thermal Conductivity | ~180W/m*K |
| Thermal Expansion | <4.2x10⁻⁶/°C |
| Dielectric Strength | >15kv/mm |
| Dielectric Constant | 8.7@1Mhz |
| Volume Resistivity | >1014 |
| Flexural Strength | 320Mpa |
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