Harwin H3153-05
Product Overview
The sub-miniature sockets are designed for mounting I.C. devices onto printed circuit boards, offering a virtually zero above-board profile. They allow tracks to be routed between sockets spaced on 2.54mm pitch centers. Featuring a closed body design to prevent solder wicking, these sockets consist of an outer brass shell with tapered entry for I.C. leads and an inner beryllium copper spring contact with four fingers. Both the shell and spring contact are available with a gold or tin finish over a nickel undercoat. These high-reliability sockets are engineered to withstand severe environmental conditions including shock, vibration, and bump, making them suitable for space-limited applications.
Product Attributes
- Brand: HARWIN
- Material (Shell): Brass
- Material (Contact): Beryllium Copper
- Finish Options: Gold or Tin (Nickel undercoat)
- Certifications: Environmental classification 55/125/56 at 95% RH
Technical Specifications
| Specification | Details |
|---|---|
| Product Code | C00611 |
| Description | Sub-Miniature Sockets |
| Current Rating (25C ambient) | 2.0A max |
| Current Rating (85C ambient) | 1.75A max |
| Contact Resistance (Initial) | 15m max |
| Contact Resistance (After conditioning) | 25m max |
| Operating Temperature Range | -55C to +125C |
| Low Air Pressure Severity | 300 mbar |
| Vibration Severity | 10Hz to 2,000Hz at 0.75mm, 98m/s (10G), duration 6 hours |
| Bump Severity | 390m/s (40G), 4000 bumps |
| Shock Severity | 981m/s (100G) for 6ms |
| Durability (Gold on contact area) | 500 mating operations |
| Durability (Tin on contact area) | 50 mating operations |
| Clip retention in body | 10N min (Average 22N from 10 sockets) |
| Insertion Force (Initial) | 6.0N max |
| Insertion Force (After Conditioning) | 2.0N min |
| Withdrawal Force (Initial) | 1.5N max |
| Withdrawal Force (After Conditioning) | 0.5N min |
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