TE Connectivity 1367147-1
Price:
Negotiable
MOQ:
1
Delivery Time:
1 working day
Brand:
1367147-1
Product Description
Product Overview
This drawing details a COVER for SFP (Small Form-factor Pluggable) components. It is a controlled document from TE Connectivity, designed for application specifications and product specifications.
Brand
TE ConnectivityDrawing Number
1367147Material
THERMOPLASTIC MOLDING COMPOUND. TIN PLATING OVER COPPER PLATING.Finish
TIN PLATING OVER COPPER PLATING.Logo
AMP LOGOFeature
OPTIONAL GATE RECESS FEATURE.| Part Number | Quantity | Material | Finish | AMP Logo | Notes | Dimensions (mm) |
|---|---|---|---|---|---|---|
| 1367147-1 | 1 | THERMOPLASTIC MOLDING COMPOUND | TIN PLATING OVER COPPER PLATING | YES | OBSOLETE. | 14.6 MAX H x 10.2 MAX W x 10.4 MAX D |
| 1367147-2 | 1 | THERMOPLASTIC MOLDING COMPOUND | TIN PLATING OVER COPPER PLATING | YES | 14.6 MAX H x 10.2 MAX W x 10.4 MAX D | |
| 1367147-3 | 2 | THERMOPLASTIC MOLDING COMPOUND | TIN PLATING OVER COPPER PLATING | NO | 14.6 MAX H x 10.2 MAX W x 10.4 MAX D |
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Company
Shenzhen ECER Network Technology Co., Ltd.
Location
Unit A2603, One Avenue (South Zone), Zhuoyue Meilin Center Plaza, No. 126 Zhongkang Road, Meidu Community, Meilin Subdistrict, Futian District, Shenzhen
Contact Person
Sales