Shenzhen ECER Network Technology Co., Ltd.
                                                                                                           
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JAE Electronics IL-AG5-30P-D3L2

Price Negotiable
Price: Negotiable
MOQ: 420
Delivery Time: 14-16 weeks
Brand: IL-AG5-30P-D3L2
Product Description

Product Overview

This document details the technical specifications and testing procedures for the JACS-1309 connector series. It covers various environmental and electrical properties to ensure reliability and performance in demanding applications.

Technical Specifications

Test ItemRequirementsParameterReference
Shock EZERDetect electrical discontinuity more than 1ms while applying 10mA.Acceleration: 490m/s, Wave form: Half sine curve, Drops: 3 times per each axis (total 18 times)MIL-STD-202, METHOD 213, CONDITION A
Oil ResistanceImmerse mated connector in engine oil (SAE10W or equivalent) and kerosene (JIS K2203) mixture at 502C for 20 hours.Oil mixture ratio: 1:1, Temperature: 502C, Duration: 20 hours
Dust ResistancePlace mated connectors in an airtight tank (approx. 1000mm per side), spray 1.5kg of Portland cement for 10 seconds every 15 minutes, diffuse evenly. Cycle 8 times. Insert/withdraw connectors every 2 cycles.Cement quantity: 1.5kg, Spray interval: 15 minutes, Cycles: 8
Sulfur Dioxide ResistanceLeave mated connectors in a tank filled with 10ppm sulfur dioxide at 402C and 90-95%RH for 24 hours.Concentration: 10ppm SO, Temperature: 402C, Humidity: 90-95%RH, Duration: 24 hours
Resistance To Solder HeatDip soldering: 2605C, 10s. Hand soldering: 35010C, 3s.Dip soldering depth: 1.5mm from housing
Solderability-wettingDip soldering area of cap assembly post to flux (rosin methanol) for 5-10 seconds, then dip to solder pool (tin: 60%, lead: 40%) at 2305C for 30.5 seconds. Observe under magnification.Flux type: Rosin methanol, Solder composition: 60% Tin/40% Lead, Solder temperature: 2305C, Solder duration: 30.5 seconds
Thermal shockNo physical damage. Satisfy low-level contact resistance (4.2.4) after test.
Moisture resistanceSatisfy leak current (4.2.6) during test. After test, satisfy insulation resistance (4.2.1), dielectric withstanding voltage (4.2.2), low-level contact resistance (4.2.4), contact retention (4.1.8), connector retention (4.1.9).
Salt sprayNo corrosion harmful for connection. Satisfy low-level contact resistance (4.2.4) and contact resistance of crimped area (4.2.7).
Insertion & withdrawal enduranceNo physical damage. Satisfy contact resistance (4.2.3), contact insertion/withdrawal force (4.1.3), connector insertion/withdrawal force (4.1.6) after test.
Pinching enduranceSatisfy contact resistance (4.2.3), contact insertion/withdrawal force (4.1.3), connector insertion/withdrawal force (4.1.6) after test.
VibrationNo mechanical damage and no electrical discontinuity more than 1ms during test. Satisfy contact resistance (4.2.3) after test.
ShockNo mechanical damage and no electrical discontinuity more than 1ms during test. Satisfy contact resistance (4.2.3), insulation resistance (4.2.1), dielectric withstanding voltage (4.2.2) after test.
Qil resistanceSatisfy contact resistance (4.2.3) after test.
Dust resistanceSatisfy contact resistance (4.2.3) after test.
Sulfur-dioxide resistanceSatisfy low-level contact resistance (4.2.4) after test.
Contact insertion & withdrawal forceInsertion force: 4.9 N max. Withdrawal force: 0.29-4.9 N5.4.1
Housing insertion force29.4N max.5.4.2
Lock strengthNo released or breakage of lock, applied 49N.5.4.3
Connector Insertion/withdrawal forceInsertion force: 4.9N x n + 14.7N max. Withdrawal force: 0.20N x n ~ 49N x n + 14.7N (n = number of contacts)5.4.4
Contact insertion force into housing9.8N max.5.4.5
Contact retention14.7N min. for Pin header, 49N min. for Crimped contact5.4.6
Connector holding force58.8N min.5.4.7
Housing reverse insertionNot reversely insertable.5.4.8
Contact reverse insertionNot reversely insertable.5.4.9
Lock releasing force49N max.5.4.10
Crimped strengthNominal section area mm: 0.85, 0.5, 0.3, 0.22. Equivalent AWG No.: 18, 20, 22, 24. Specified [N]: 127.4, 88.2, 49, 35.55.4.11
Insulation resistance100M min. at initial, 50M min. after test5.4.12
Dielectric withstanding voltageNo deformation or deposition damage in a housing and contacts.5.4.13
Contact resistance10m max. at initial, 20m max. after test5.4.14
Low-level contact resistance10m max. at initial, 20m max. after test5.4.15
Temperature riseTemperature rise 50C max. at crimped area.5.4.16
Leak current1mA max.5.4.17
Contact resistance of crimped area2m max. at initial, 3m max. after test5.4.18
High-temperature exposureSatisfy low-level contact resistance (4.2.4) and contact retention (4.1.8) after test.5.4.19
Low-temperature exposureSatisfy low-level contact resistance (4.2.4) after test. No crack or deformation in the housing after drop test.5.4.20

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Company Shenzhen ECER Network Technology Co., Ltd.
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